Nvidia Senior Package Design Engineer 

Israel, North District 

159899216

What you'll be doing:

• Leading the development of groundbreaking microelectronics packaging for Nvidia Networking Business Unit's future products

• Collaborating with world-leading vendors to develop highly ambitious packaging solutions

• Thriving in a dynamic and challenging environment

• Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues

What we need to see:

• BSc or equivalent experience in Mechanical Engineering / Materials Engineering / Physics or similar

• At least 5 years of experience with complex ASIC package development and manufacturing

• Hands-on FEA mechanical simulation experience

• Experience co-working with subcontractors and vendors

• Vision and focus for projects and team

• Curious and creative problem solver as well as organized and multi-tasker

• Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)

• High awareness of quality, manufacturability and project schedule

Ways to stand out from the crowd:

• Experience with manufacturing environment and manufacturing statistics tools (for example – JMP)

• Background in semiconductor manufacturing processes