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Nvidia Senior Package Design Engineer 
Israel, North District 
159899216

31.07.2024

What you'll be doing:

  • Leading the development of groundbreaking microelectronics packaging for Nvidia Networking Business Unit's future products

  • Collaborating with world-leading vendors to develop highly ambitious packaging solutions

  • Thriving in a dynamic and challenging environment

  • Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues

What we need to see:

  • BSc or equivalent experience in Mechanical Engineering / Materials Engineering / Physics or similar

  • At least 5 years of experience with complex ASIC package development and manufacturing

  • Hands-on FEA mechanical simulation experience

  • Experience co-working with subcontractors and vendors

  • Vision and focus for projects and team

  • Curious and creative problem solver as well as organized and multi-tasker

  • Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)

  • High awareness of quality, manufacturability and project schedule

Ways to stand out from the crowd:

  • Experience with manufacturing environment and manufacturing statistics tools (for example – JMP)

  • Background in semiconductor manufacturing processes