Nvidia Senior Package Layout Engineer 

Israel, North District 

966256844

What you'll be doing:

• As part of a IC Packaging design team, you will collaborate to implement high speed and PDN design for ASIC packages.

• Develop symbols, pad stack and perform substrate package routing, placement, stack-up, reference plane, power distribution using Cadence APD or SiP tools.

• Optimize package pin out incorporating system level trade-offs of pins assignment.

• Develop methodologies to improve layout environment, productivity, reliability, and schedule considerations.

• In close co-operation with the SI/PI/HW design teams and product teams

• Planning, ensuring stakeholder management and leading projects from start to finish

What we need to see:

• B.Sc. Electrical Engineering or an Electrical Practical Engineer certificate or equivalent experience

• 5+ years hands-on in Package/PCB Layout and outing experience; including high speed design signal integrity practices.

• Experience in substrate layout of wire bond and flip chip packages, preferred

• Knowledge in substrates or board manufacturing process

• Significant background with Cadence Virtuoso and APD or SiP and/or other PCB layout tools

Ways to stand out in the crowd:

• Knowledge in Ansys (SIwave, HFSS) or Cadence (Sigrity, PowerSI) simulation tools

• Familiarity with Skill language (Cadence) and basic parsing abilities(Python/Perl/Shell-scripting)