Expoint - all jobs in one place

מציאת משרת הייטק בחברות הטובות ביותר מעולם לא הייתה קלה יותר

Limitless High-tech career opportunities - Expoint

Nvidia Senior Package Layout Engineer 
Israel, North District 
966256844

29.04.2025
Israel, Yokneam
time type
Full time
posted on
Posted 25 Days Ago
job requisition id

What you'll be doing:

  • As part of a IC Packaging design team, you will collaborate to implement high speed and PDN design for ASIC packages.

  • Develop symbols, pad stack and perform substrate package routing, placement, stack-up, reference plane, power distribution using Cadence APD (Allegro) or SiP tools.

  • Optimize package pin out incorporating system level trade-offs of pins assignment.

  • Develop methodologies to improve layout environment, productivity, reliability, and schedule considerations.

  • In close co-operation with the SI/PI/HW design teams and product teams

  • Planning, ensuring stakeholder management and leading projects from start to finish

What we need to see:

  • B.Sc. Electrical Engineering or an Electrical Practical Engineer certificate or equivalent experience

  • 5+ years hands-on in Package/PCB Layout and outing experience; including high speed design signal integrity practices.

  • Experience in substrate layout of wire bond and flip chip packages, preferred

  • Knowledge in substrates or board manufacturing process

  • Significant background with Cadence Virtuoso and APD (Allegro) or SiP and/or other PCB layout tools

Ways to stand out in the crowd:

  • Knowledge in Ansys (SIwave, HFSS) or Cadence (Sigrity, PowerSI) simulation tools

  • Familiarity with Skill language (Cadence) and basic parsing abilities(Python/Perl/Shell-scripting)