Expoint – all jobs in one place
המקום בו המומחים והחברות הטובות ביותר נפגשים
Limitless High-tech career opportunities - Expoint

Nvidia Senior Package Engineer 
Israel, North District 
866338258

Yesterday
Israel, Yokneam
time type
Full time
posted on
Posted 30+ Days Ago
job requisition id

What you'll be doing:

  • Leading the development of groundbreaking microelectronics packaging for Nvidia Networking Business Unit's future products

  • Collaborating with world-leading vendors to develop highly ambitious packaging solutions

  • Thriving in a dynamic and challenging environment

  • Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues

What we need to see:

  • BSc or equivalent experience in Mechanical Engineering / Materials Engineering / Physics or similar

  • 10+ years of experience ,at least 5 years of experience with complex ASIC package development and manufacturing

  • Experience co-working with subcontractors and vendors

  • Vision and focus for projects and team

  • Curious and creative problem solver as well as organized and multi-tasker

  • Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)

  • High awareness of quality, manufacturability and project schedule

Ways to stand out of the crowd:

  • Hands-on FEA mechanical simulation experience

  • Team / Group / Project management - advantage

  • Experience with manufacturing environment and manufacturing statistics tools (for example – JMP)

  • Background in semiconductor manufacturing processes