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Applied Materials Metrology Engineer III United States, Arizona, Tempe 112183726
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$108,000.00 - $148,500.00
Key Responsibilities
Apply knowledge of electronic microscopy techniques to image wafers for customer demos to aid in the success of meeting customer requirements
Participate in creating recipes to optimize FIB prep of TEM samples
Support other metrology techniques including XRR, XRD, XRF, AFM, SE
Work with Arizona State University (ASU) to use TEM equipment on ASU campus
Generate and distribute Best Known Methods (BKMs) for film imaging
Functional Knowledge
- Hands on experience with SEM, FIB, STEM, and or TEM
Business Expertise
- Basic understanding of the semiconductor industry and thin film deposition
Leadership
- No supervisory responsibilities; accountable for developing technical contribution
Problem Solving
- Uses existing procedures to solve standard problems; analyzes information and standard practices to make judgments
Impact
- Has limited impact on own work team; works within standardized procedures and practices to achieve objectives and meet deadlines
Interpersonal Skills
- Exchanges straightforward information, asks questions and checks for understanding
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