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The Impact You’ll Make in this Role
As a
Lead Design Operations Project Manager , you will have the opportunity to tap into your curiosity and collaborate with some of the most innovative people around the world. Here, you will make an impact by:
Your Skills and Expertise
To set you up for success in this role from day one, 3M requires (at a minimum) the following qualifications:
Additional qualifications that could help you succeed even further in this role include:
Work location:
Please note: your application may not be considered if you do not provide your education and work history, either by: 1) uploading a resume, or 2) entering the information into the application fields directly.
Please access the linked document by clicking select the country where you are applying for employment, and review. Before submitting your application, you will be asked to confirm your agreement with the terms.
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What You’ll Be Doing:
Lead the product strategy and execution for NVIDIA’s Omniverse Digital Twin platform focused on Digital Twin robotics and automation integration use cases. Drive cross-functional alignment and deliver features that enable scalable, Physical AI-powered simulation solutions.
Define and manage roadmap, use cases, and user journeys for industrial digital twins
Translate customer needs into clear, prioritized requirements
Partner with engineering to drive execution and technical trade-offs
Serve as a voice of the customer across development and GTM teams
Mentor and guide junior PMs to grow product leadership capacity
POR & One-page summaries of strategic intent
Product roadmap with quarterly milestones and long-term vision
PRDs with use cases, personas, and workflows
Capability and release launch plans in coordination with GTM and engineering
What We Need To See:
7+ years in product management, including experience owning sophisticated platform or developer-facing products.
BS or MS in Computer Science, Engineering, or equivalent experience.
Confident navigating cross-functional leadership and high-stakes decision-making, with the ability to lead product initiatives and drive alignment.
Background in robotics, automation, simulation, or digital twins — or a proven track record to ramp up quickly in highly technical domains.
A strategic and systems thinker, equally comfortable defining big-picture vision and execution details.
Experience in both startup and large enterprise settings; adaptable, pragmatic, and process-aware.
Ways To Stand Out From The Crowd:
Strong sense of purpose and ownership, with an ability to prioritize, deliver product, and encourage those around you.
Humble, collaborative, and curious, always seeking new ways to tackle problems and empower your team.
You will also be eligible for equity and .

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This position requires the incumbent to have a sufficient knowledge of English to have professional verbal and written exchanges in this language since the performance of the duties related to this position requires frequent and regular communication with colleagues and partners located worldwide and whose common language is English.
Gross pay salary$123,300—$184,900 USD
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What You Will Be Doing:
Bring new products and new technologies to high volume manufacturing
Deliver datamation solutions for enhanced decision making
Manage supplier performance evaluation matrix and keep it updated based on changing business needs
Drive continuous improvement in manufacturing yield, cycle time and product quality/reliability
Lead change control through qualification and notification
Lead non-conforming material disposition
Manage BOM supply chain and optimize sourcing solutions for best capacity and cost
What We Need To See:
Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, Chemical Engineering fields (or equivalent experience)
12+ years of validated experience in Flip Chip semiconductor packaging design, process and materials development. Direct experience in advanced assembly technologies such as 2.5D/3D packaging, Photonics packaging experience is desirable
Solid technical knowledge of materials, process, package design and equipment technologies in substrate, bumping, and chip assembly
Strong skills in project management and supplier management
Solid understanding of quality control, statistics process control, gage R&R and DOE techniques
Good knowledge of packaging industry and its supply chain
Excellent written and verbal communication skills
Experience working with multi-functional teams across the world
You will also be eligible for equity and .

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This position requires the incumbent to have a sufficient knowledge of English to have professional verbal and written exchanges in this language since the performance of the duties related to this position requires frequent and regular communication with colleagues and partners located worldwide and whose common language is English.

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What you'll be doing:
Path-find technical innovations in Quantum Error Correction and Fault Tolerance, working with multi-functional teams in Product, Engineering, and Applied Research
Develop novel approaches to quantum error correction codes and their logical operations, including methods for implementation and logical operation synthesis
Research and co-design improved methods to achieve fault tolerance, such as techniques for logical operations, concatenation, synthesis, distillation, cultivation, or others
Collaborate with internal teams and external partners on developing technology components to enable a fault-tolerant software stack integrated with quantum hardware
Adopt a culture of collaboration, rapid innovation, technical depth, and creative problem solving
What we need to see:
Degree in Physics, Computer Science, Chemistry, Applied Mathematics, or related engineering field or equivalent experience (Ph.D. preferred)
Extensive background in Quantum Information Science with 8+ overall years of experience in the Quantum Computing industry
A demonstrated ability to deliver high impact value in quantum error correction and fault tolerance
Ways to stand out from the crowd:
Hands-on experience in scientific computing, high-performance computing, applied machine learning, or deep learning
Experience with co-design of quantum error correction with quantum hardware or quantum applications
Experience with CUDA and NVIDIA GPUs
Passion to drive technology innovations into NVIDIA software and hardware products to support Quantum Computing
You will also be eligible for equity and .

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Pursuant to the San Francisco Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.
This position requires the incumbent to have a sufficient knowledge of English to have professional verbal and written exchanges in this language since the performance of the duties related to this position requires frequent and regular communication with colleagues and partners located worldwide and whose common language is English.
Gross pay salary$98,000—$187,000 USD
The Impact You’ll Make in this Role
As a
Lead Design Operations Project Manager , you will have the opportunity to tap into your curiosity and collaborate with some of the most innovative people around the world. Here, you will make an impact by:
Your Skills and Expertise
To set you up for success in this role from day one, 3M requires (at a minimum) the following qualifications:
Additional qualifications that could help you succeed even further in this role include:
Work location:
Please note: your application may not be considered if you do not provide your education and work history, either by: 1) uploading a resume, or 2) entering the information into the application fields directly.
Please access the linked document by clicking select the country where you are applying for employment, and review. Before submitting your application, you will be asked to confirm your agreement with the terms.
These jobs might be a good fit