Signal Processing jobs in Israel

Key job responsibilities
As a SIP engineer, you will be involved in:
• Work on advanced high-speed interfaces such as PCIe, DDR and Ethernet.
• End-to-end solution of high-speed interfaces; from floor-planning at the DIE level, through Package and PCB routing, addressing both robust SI/PI considerations as well as optimizing layout routing.
• Signal and power integrity modeling and simulation of high-speed interconnects using advanced SI/PI simulation tools.
• Hands-on lab work involving oscilloscopes, spectrum analyzers, and other RF/mixed-signal measurement equipment, for advanced electrical characterization.You will undergo a comprehensive training program, providing you with the essential knowledge and skills required to succeed in this field. The work is multidisciplinary, bridging physical design, electromagnetic theory, and practical engineering challenges.

- Communication, Electromagnetics, Signal processing, Microelectronics.
- Previous experience with lab equipment (e.g oscilloscope, spectrum analyzer).
- Familiarity with simulation/extraction tools (e.g. HFSS, Sigrity, HSpice).

Key job responsibilities
As a SIP engineer, you will be invoved in:
• Work on cutting edge high-speed interfaces such as PCIe, DDR and Ethernet.
• End-to-end solution of high-speed interfaces; from floor-planning at the DIE level, through Package and PCB routing, addressing both robust SI/PI considerations as well as optimizing layout routing.
• Signal and power integrity modeling and simulation of high-speed interconnects using advanced SI/PI simulation tools.
• Hands-on lab work involving oscilloscopes, spectrum analyzers, and other RF/mixed-signal measurement equipment, for advanced electrical characterization.You will undergo a comprehensive training program, providing you with the essential knowledge and skills required to succeed in this field. The work is multidisciplinary, bridging physical design, electromagnetic theory, and practical engineering challenges.About the team
Diverse Experiences
AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn’t followed a traditional path, or includes alternative experiences, don’t let it stop you from applying.
Why AWS?Inclusive Team CultureMentorship & Career Growth
We’re continuously raising our performance bar as we strive to become Earth’s Best Employer. That’s why you’ll find endless knowledge-sharing, mentorship and other career-advancing resources here to help you develop into a better-rounded professional.
Work/Life Balance

- • BSc in Electrical Engineering or Electrical Engineering and Physics. Make sure to include a grade sheet with your CV, in a single PDF.
- • Strong foundations in physics and electromagnetics

- • Communication, Electromagnetics, Signal processing, Microelectrinics
- • Previous experience with lab equipment (e.g oscilloscope, spectrum analyzer) is a strong advantage
- • Familiarity with simulation/extraction tools (e.g. HFSS, Sigrity, HSpice) - an advantage

This position is for an experienced engineer with strong background in high-speed electrical interfaces, such as DRAM, PCIe, Ethernet SerDeses.
The line of work is multi-disciplinary, combining Package-Design, Back-End integration of electrical IPs, SI/PI extractions & simulations.Key job responsibilities
As a SIP team member, you will assume responsibility for all electrical aspects of physical interfaces of advanced I/Os, PLL, Memory and SerDes interfaces, from integration at the Die level, through SI/PI simulation and package layout, to reference board design aspects.
The scope of your work will include:
• Deep dive into electrical IPs, integrated into the DIE;
• I/O ring design and close work with Backend team on floor-planning all I/O interfaces at the DIE level.
• Lead test studies of Die bump-out arrangements and Package substrate breakout.
• Lead layout test studies of package pin-out arrangements and PCB board breakout.
• Design large and complex package substrates.
• Carry advanced SI/PI extractions and simulations to validate the design from the silicon to the peer device at the board level.About the team
Diverse Experiences
Amazon values diverse experiences. Even if you do not meet all of the preferred qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn’t followed a traditional path, or includes alternative experiences, don’t let it stop you from applying.Why AWS
Work/Life BalanceMentorship and Career Growth
We’re continuously raising our performance bar as we strive to become Earth’s Best Employer. That’s why you’ll find endless knowledge-sharing, mentorship and other career-advancing resources here to help you develop into a better-rounded professional.

- Knowledge of Chip, Package and PCB co-design methodology.
- Knowledge in high-speed digital interfaces such as DRAM/PCIe/SerDes.
- Knowledge in power-integrity and power-delivery of low-voltage high-current – an advantage
- Hands on experience with lab testing and characterization – an advantage.
- Familiarity with simulation/extraction tools (e.g. HFSS, Sigrity, HSpice) - an advantage

What you'll be doing:

• Define and perform characterization for our systems up to 400Gb/s per channel.

• Characterization of high frequencies PCB, connectors and cable channels up to 400Gb/s

• Perform characterization and compliance tests for optical cables and optical devices.

• Leading the Layer 1 specifications (InfiniBand, Ethernet, PCI-Ex) from all signal integrity aspects.

• Work in intense environment and control multidiscipline expertise.

What we need to see:

• B.Sc. in Electrical Engineering with 3+ years of relevant experience or M.Sc./Ph.D. in Electrical Engineering with minimum 2 years of relevant experience.

• Experience in lab tools such as Network Analyzer, Scope, TDR and Spectrum Analyzer.

• Familiar with InfiniBand, Ethernet and PCI-Ex Layer 1 specifications.

Ways to Stand Out From the Crowd:

• Familiar with optical experiments and tools.

• M.Sc./Ph.D. in Electrical Engineering.

What you'll be doing:

• Mixed-Signal/Analog circuit design for High Speed circuit and I/O Interfaces

• Solve challenges of circuit designs in advanced node CMOS FinFET processes

• Take designs through productization and be involved in all stages of development, from concept to product

• Work with multi-functional teams to optimize the designs

What we need to see:

• BSEE, MSEE or PhD

• Candidate must have 5+ years of well-rounded High-Speed circuits designs such as ADC, DAC, PLL, and SerDes related design experience.

• A teammate with good interpersonal skills

• System-level architecture, timing budgets, specs, and analysis

• In-depth understanding of deep submicron CMOS FinFET process and circuit design issues

• Familiarity with device reliability, ESD, and Latch-Up requirements

• Supervise layout development and understand all physical implementation aspects

Ways to stand out from the crowd :

• Deep understanding of package substrate, board design, and power delivery.

• Extensive experience in using advanced simulation tools

• Hands on with Lab test and measurement equipment is a plus