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Cpu-soc Silicon Design Engineering Part Time Intern jobs at Intel in Malaysia

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Intel Silicon Packaging Architect Malaysia, Penang

Limitless High-tech career opportunities - Expoint
Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements. Leads technology tradeoff decisions ensuring silicon packages conform to electrical, mechanical, thermal, and...
Description:
Job Description:
  • Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements.
  • Leads technology tradeoff decisions ensuring silicon packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones.
  • Collaborates with silicon, hardware, and package leads to ensure high quality package output and aids in removing roadblocks.
  • Oversees end-to-end package development process, including design, processes, and procedures and continuously improves packaging quality standards and targets.
  • Applies expertise in package design troubleshooting, resolves new and existing packaging problems involving designs, materials, and processes and provides innovative and cost-effective solutions.
  • Collaborates with manufacturing team to ensure the packaging design and tape-out seamlessly transition to production.
Qualifications:
  • Bachelor Degree in relevant engineering/science domain with minimum 10 years of experience in the package design and/or architecture.
  • Prior leadership role in package technology readiness development, design tape-out and/or innovation.
Experienced HireShift 1 (Malaysia)Malaysia, Penang

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10.11.2025
I

Intel Graduate Talent ISCP SV Design Verification Engineer Malaysia, Penang

Limitless High-tech career opportunities - Expoint
Develops pre silicon functional validation strategy, test plan, test suite, test methodologies for state of the art SoC/chipset. Collaborates with architects, micro architects, design and system validation teams for IP/SoC...
Description:
-Develops pre-silicon functional validation strategy, test plan, test suite, test methodologies for state-of-the-art SoC/chipset.-Collaborates with architects, micro-architects, design and system validation teams for IP/SoC validation strategy, technical readiness and failure disposition.-Performs low level and complex debug for multiple systems, subsystems within a product, or at the IP/SoC level for Intel products. -Applies deep understanding of IP/SoC design, architecture, firmware, and software to resolve triage failures, marginality issues, and conduct root cause analysis.-Defines, develops, and implements techniques for faster debug at the IP/SoC and platform level and isolates failing components of a system.-Graduates from Bachelor / Master's degree in Electrical and/or Electronic Engineering, Computer or Microelectronic Engineering . -Knowledge on Computer System Architecture and/or related software-hardware sub-systems.-Knowledge on software programming in Python, Maestro/Perspec, C and/or C++ language and UNIX, automate verification flow and improve efficiency.Shift 1 (Malaysia)Malaysia, Penang

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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09.11.2025
I

Intel Graduate Talent ISCP SV Design Verification Engineer Malaysia, Penang

Limitless High-tech career opportunities - Expoint
Develops pre silicon functional validation strategy, test plan, test suite, test methodologies for state of the art SoC/chipset. Collaborates with architects, micro architects, design and system validation teams for IP/SoC...
Description:
-Develops pre-silicon functional validation strategy, test plan, test suite, test methodologies for state-of-the-art SoC/chipset.-Collaborates with architects, micro-architects, design and system validation teams for IP/SoC validation strategy, technical readiness and failure disposition.-Performs low level and complex debug for multiple systems, subsystems within a product, or at the IP/SoC level for Intel products. -Applies deep understanding of IP/SoC design, architecture, firmware, and software to resolve triage failures, marginality issues, and conduct root cause analysis.-Defines, develops, and implements techniques for faster debug at the IP/SoC and platform level and isolates failing components of a system.-Graduates from Bachelor/Master's degree in Electrical and/or Electronic Engineering, Computer or Microelectronic Engineering. -Knowledge on Computer System Architecture and/or related software-hardware sub-systems.-Knowledge on software programming in Python, Maestro/Perspec, C and/or C++ language and UNIX, automate verification flow and improve efficiency.Shift 1 (Malaysia)Malaysia, Penang

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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08.11.2025
I

Intel CPU Design Verification Engineer Malaysia, Penang

Limitless High-tech career opportunities - Expoint
Performs Pre-Silicon functional verification of CPU logic to ensure design will meet specification requirements. Develops IP verification plans, test benches, and the verification environment to ensure coverage to confirm to...
Description:
Job Description:
  • Performs Pre-Silicon functional verification of CPU logic to ensure design will meet specification requirements.

  • Develops IP verification plans, test benches, and the verification environment to ensure coverage to confirm to CPU microarchitecture specifications.

  • Executes verification plans and defines and runs system simulation models to verify the design and uncover bugs.

  • Replicates, root causes, and debugs issues in the Pre-silicon environment.

  • Finds and implements corrective measures to resolve failing tests.

  • Collaborates with CPU architects/RTL developers to improve verification of complex architectural and microarchitectural features and to meet functional, performance, and power goals.

  • Documents test plans and drives technical reviews of plans and proofs with design and architecture teams.

  • Maintains and improves existing functional verification infrastructure and methodology.

Qualifications:
  • Bachelor's or Master's degree in Electrical or Electronics Engineering, Computer Engineering, or any related field.

  • Good knowledge in CPU architecture and Computer System.

  • Experience with System Verilog and UVM.

  • Experience with scripting (i.e PERL, Phyton).

  • Familiar with verification tools and methodologies.

  • Excellent problem-solving and debugging skills.

  • Effective communication and collaboration abilities.

  • Self-motivated and able to work effectively in a dynamic, fast-paced environment.

Experienced HireShift 1 (Malaysia)Malaysia, Penang

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
Show more
Limitless High-tech career opportunities - Expoint
Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements. Leads technology tradeoff decisions ensuring silicon packages conform to electrical, mechanical, thermal, and...
Description:
Job Description:
  • Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements.
  • Leads technology tradeoff decisions ensuring silicon packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones.
  • Collaborates with silicon, hardware, and package leads to ensure high quality package output and aids in removing roadblocks.
  • Oversees end-to-end package development process, including design, processes, and procedures and continuously improves packaging quality standards and targets.
  • Applies expertise in package design troubleshooting, resolves new and existing packaging problems involving designs, materials, and processes and provides innovative and cost-effective solutions.
  • Collaborates with manufacturing team to ensure the packaging design and tape-out seamlessly transition to production.
Qualifications:
  • Bachelor Degree in relevant engineering/science domain with minimum 10 years of experience in the package design and/or architecture.
  • Prior leadership role in package technology readiness development, design tape-out and/or innovation.
Experienced HireShift 1 (Malaysia)Malaysia, Penang

Show more
Find your dream job in the high tech industry with Expoint. With our platform you can easily search for Cpu-soc Silicon Design Engineering Part Time Intern opportunities at Intel in Malaysia. Whether you're seeking a new challenge or looking to work with a specific organization in a specific role, Expoint makes it easy to find your perfect job match. Connect with top companies in your desired area and advance your career in the high tech field. Sign up today and take the next step in your career journey with Expoint.