Account Sales Iii - S3 jobs at Applied Materials in Taiwan, Hsinchu

Key Responsibilities

• Act as the primary interface for TSMC on Varian implant tools OR Advanced Packaging applications, ensuring Applied Materials secures opportunities in advanced nodes and packaging technologies.
• Develop and implement account strategies to support technology transitions.
• Lead negotiations on tool bridging, warranty extensions, and resource planning for fab ramp-up and high-volume manufacturing.
• Consolidate risk assessments and opportunity applications across multiple nodes; ensure Applied Materials maintains competitive positioning.
• Coordinate new tool introductions, NSO (New System Orders), and relocation requirements for advanced fabs.
• Engage with TSMC R&D teams to influence design-to-order (DTO) decisions.
• Present Applied Materials’ product roadmap and capabilities; communicate customer requirements to internal product teams.
• Prepare and negotiate pricing proposals, manage order booking, and monitor account receivables.
• Maintain detailed documentation of customer interactions, visit summaries, and action plans; ensure timely execution.

Requirements

• M.S. or B.S. degree in Engineering or related field.
• 2+ years of semiconductor sales experience with one or more of the following tools: DDP, CMP, ETCH, IMP, MDP, PDC, FEP.
• Proven experience in technical sales or account management, preferably with TSMC or semiconductor industry customers.
• Strong interpersonal and communication skills with ability to influence at all levels.
• Excellent English communication and presentation skills.
• Ability to travel as needed (approx. 20%).

Key Responsibilities

Enable Next-Gen Solutions Through Direct Engagement:

• Act as the technical owner for PVD solutions at assigned OSATs and Fabless accounts, ensuring alignment between design requirements and manufacturing processes.

• Understand Customers and Fabless stakes holders technical roadmap.

• Partner with Fabless packaging architects to define material stacks, reliability criteria, and integration flows; translate these into executable solutions for OSATs.

• Lead joint qualification programs involving Fabless and OSAT stakeholders: define success metrics, DoEs, and acceptance gates; manage execution to schedule.

Process Qualification & Ramp:

• Establish process-of-record (POR) for advanced packaging applications (e.g., RDL barrier/seed, TSV liners, hybrid bonding underlayers).

• Drive tool acceptance (FAT/SAT) and HVM ramp at OSAT sites: SPC setup, chamber matching, defectivity control, and yield stabilization.

• Validate PVD film integrity under Fabless-driven reliability tests (JEDEC/IPC standards: EM, TDDB, thermal cycling).

Cross-Functional Collaboration:

• Coordinate with Applied Materials’ Product Engineering, Field Service, and Quality teams to deliver robust solutions tailored to OSAT and Fabless needs.

• Resolve integration challenges across packaging flows (e.g., ESD, adhesion, contamination, stress) through structured problem-solving.

Continuous Improvement:

• Lead structured root cause analysis on yield/reliability excursions; implement corrective actions and verify effectiveness.

• Provide feedback to internal engineering for hardware and process enhancements based on OSAT and Fabless requirements.

Required Qualifications

• Bachelor’s or Master’s in Materials Science, Physics, Chemical Engineering, or related field; PhD preferred.

• 10+ years in semiconductor equipment/process engineering with strong PVD experience in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).

• Proven success enabling solutions through direct engagement with OSATs and Fabless design houses.

Preferred Qualifications

• Experience enabling hybrid bonding or chiplet integration through PVD underlayers.

• Familiarity with APAC OSAT ecosystem and Fabless packaging roadmaps.

• Proficiency in SPC, DOE, metrology, and yield analytics.

• Expertise in thin-film metallurgy (Cu, Ni, Ti, Ta/TaN, Co) and reliability-critical stack design.

• Strong communication skills to engage executive Fabless stakeholders and OSAT engineering teams.

Key Responsibilities

• Prepares, records, analyzes and reports accounting transactions and ensures the integrity of accounting records for completeness, accuracy and compliance with accepted accounting policies and principles
• Monitors performance to service level agreements and initiates appropriate remedial actions
• Conducts management book and legal book reconciliation, P&L analysis and prepares relevant reporting
• Reviews and analyses GL account balance
• Participates inventory count and reviews inventory count results to comply with internal and external policy
• Identifies internal control gaps and financial discrepancies in business procedures, processes or systems, and initiates appropriate remedial action
• Support global projects and collaborate with colleagues in other regions/time zones
• Completes detailed analysis and commentary for business partner,including both finance and non-finance stakeholders.
• Key participant or lead for system integration or process improvement initiatives
• Integrates acquisitions into global processes and financial systems

Problem Solving

• Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information

Interpersonal Skills

• Explains difficult or sensitive information; works to build consensus

Leadership

• Acts as a resource for colleagues with less experience; may lead small projects with manageable risks and resource requirements

Functional Knowledge

• Demonstrates conceptual and practical expertise in own discipline and basic knowledge of related disciplines

Business Expertise

• Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market

Impact

• Impacts a range of customer, operational, project or service activities within own team and other related teams; works within broad guidelines and policies

Key Responsibilities

1. Complete definition and design of complex components, modules and sub systems. Contribute to the system engineering specification both within the field of one's expertise and broadening into other disciplines. Ensure designs meet market requirement specifications (MRS). Coordinate with project marketing and management to understand sub system requirements. Be able to chair architecture brainstorming meetings and drive the systems process to down select to a final architecture of a subsystem.
2. Conduct detailed engineering analysis of sub systems using vast knowledge of design concepts and functional requirements pertaining to field of technical expertise and broadening into other disciplines. Assist in creating concepts for architectural design approaches. Evaluate architectures to provide recommendation for best system solution approach.
3. Build and qualify prototypes of new designs, or procure entire subsystems from outsourced suppliers and test for compliance with detailed specifications
4. Problem identification and troubleshooting a variety of difficult engineering problems in field of technical expertise, including serviceability and manufacturability.
5. Support System Integration during the assembly and final testing of new product designs.
6. Perform and coordinate tests as per internal as well as industry-accepted reliability specifications. Make suitable design or operational changes as required.
7. Support system engineering projects that have a substantial mix of electrical, mechanical, physics, algorithms and software design, and understand the underlying system implications.
8. Provide remote and onsite support to field support personnel as required.

Functional Knowledge

• Demonstrates conceptual and practical expertise in own discipline and basic knowledge of related disciplines

Business Expertise

• Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market

Leadership

• Acts as a resource for colleagues with less experience; may lead small projects with manageable risks and resource requirements

Problem Solving

• Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information

Impact

• Impacts a range of customer, operational, project or service activities within own team and other related teams; works within broad guidelines and policies

Interpersonal Skills

• Explains difficult or sensitive information; works to build consensus

Key Responsibilities

Completes detailed analysis and commentary for finance and non finance executives

Performs required activities and analysis to complete close, flash or commit with minimal oversight on recurring tasks

Key participant or lead for system integration or process improvement initiatives

Functional Knowledge

• Demonstrates conceptual and practical expertise in own discipline and basic knowledge of related disciplines

Business Expertise

• Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market

Leadership

• Acts as a resource for colleagues with less experience; may lead small projects with manageable risks and resource requirements

Problem Solving

• Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information

Impact

• Impacts a range of customer, operational, project or service activities within own team and other related teams; works within broad guidelines and policies

Interpersonal Skills

• Explains difficult or sensitive information; works to build consensus

Technical Support Engineer (TSE)

TSEs provide technical support remotely, and on site, to FSO personnel for highly complex problems involving equipment malfunction, on wafer issues, and performance enhancement programs where first-line product support was unable to isolate or fix a problem. Using advanced troubleshooting methodologies, they establish success criteria, develop comprehensive action plans, analyze and compile findings, perform root cause analysis and support FSO repair activities through escalation closure.

• Support multiple technical escalations, resolve with focus on time to resolution and quality of work

• Attend customer field issues meetings with FSO, collaborate with BU engineers

• Recommend best practices to improve products, processes, or services.

• Publishing Technical Lessons Learned, troubleshooting guides, technical (ET) papers, etc.

• Provide on-site coaching to FSO

• Provide Alpha and Beta Site support

• Support NPI development early in the product life cycle, and at key customer sites

• Support BU DFx (Design for Service / Install) projects

• Create, or collaborate in creation of, innovative advanced trouble shooting tools

Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market.

Provides coaching to colleagues with less experience; may lead small projects with manageable risks and resource requirements.

Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information and data.

Explains difficult or sensitive information; works to build consensus. Manage difficult situations in stressful environments.

• Education:
  Bachelor’s degree or equivalent in technical field

• Skills:

  • Ability to work independently and as part of a team

  • Strong organizational and time management skills

  • Excellent interpersonal and communication skills

  • Ability to handle stressful situations and effectively manage difficult problems

  • Familiar with suite of Microsoft Apps, and internal ones such as SAP, VSPI, and ARK

• Certifications:
  Applied Materials Etch Product Certification or equivalent.

• Languages:
  English (written and verbal)

• Years of Experience:
  3+ years of experience with Applied Materials SRP products or similar semiconductor equipment.

• Work Experience:
  Minimum 3 years of semiconductor fab HW experience

• Shift:
  Mon-Fri 8 hr per day

• Travel:
  Yes, generally 25% of the time, but could be as high as 50%.

• Relocation Eligible:
  No

Key Responsibilities

Completes detailed analysis and commentary for finance and non finance executives

Performs required activities and analysis to complete close, flash or commit with minimal oversight on recurring tasks

Key participant or lead for system integration or process improvement initiatives

Functional Knowledge

• Demonstrates conceptual and practical expertise in own discipline and basic knowledge of related disciplines

Business Expertise

• Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market

Leadership

• Acts as a resource for colleagues with less experience; may lead small projects with manageable risks and resource requirements

Problem Solving

• Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information

Impact

• Impacts a range of customer, operational, project or service activities within own team and other related teams; works within broad guidelines and policies

Interpersonal Skills

• Explains difficult or sensitive information; works to build consensus