

Share
Advanced Packaging Process Development
Define and implement process flows for panel-level packaging and other advanced panel technologies.
Drive material selection and compatibility studies for large-format form factors.
Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.
Develop innovative solutions as part of proven track record of significant technology contributions. Recognized internally (across Business Units) as one of the limited number of technical experts in their field of expertise
Conceive and implement new technology, normally named as primary inventor on numerous critical patents and recognized through awards and/or published papers within the last five years.
Leads and collaborates to contribute to the development of new principles and concepts. Guides less experienced engineers in utilizing techniques to define methods and new technologies and apply them on unusually complex systems. Involved in judging the approach and verifying the validity of technical strategies.
Functional Knowledge
Optimize thin film deposition techniques such as Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD) (Including PECVD for low-temperature applications), Atomic Layer Deposition (ALD) for atomic-scale control and high-k dielectrics.
Electrochemical Deposition (ECD): For metal layers in advanced packaging.
Cross-Functional Collaboration
Works with business unit in technology development and transfer to customers including customized process development. Plans unit process sequence based on customer requirements. Negotiates process specifications and service offerings with customers. Takes ownership of delivering the required solution to the customers that meets specification.
Serves as the customer expert across a broad range of products. Plays a key role in defining product strategy and identifying gaps. Provides feedback to business unit heads on process and hardware improvements to meet customer roadmap requirements.
Work closely with design, reliability, and materials teams to ensure manufacturability and performance.
Support technology transfer from development to high-volume manufacturing.
Provides oversight of customer demos, including defining demo conditions and analyzing results.
Data Analysis and Continuous Improvement
Analyze process data for trend identification and optimization.
Drive continuous improvement initiatives for unit level process and cycle time improvement.
Conduct root cause analysis for defects and implement corrective actions to improve yield and reliability.
Within safety guidelines design, perform, collect data, analyze and compile reports on unusually complex engineering experiments and provides solutions which are highly innovative and ingenious.
Requirements
Bachelor’s degree with 15 years of experience, Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field.
Expertise in thin film deposition techniques and dielectric etch and panel packaging process integration .
Experience with advanced packaging technologies such as fan-out panel-level packaging (FOPLP), substrate technology and wafer Back-end technology.
Knowledge of industry standards and best practices in semiconductor packaging.
Strong understanding of semiconductor packaging technologies and process flows.
Strong knowledge of process characterization and troubleshooting.
Excellent problem-solving skills and ability to work in a fast-paced environment.
Ability to work in a cleanroom environment
Excellent communication skills
Work Location
Science Park II (Moving to Tampines in end 2026)
These jobs might be a good fit

Share
About this role
Looking for a motivated and hands-onto support the setup and ramp of our next-generation semiconductor manufacturing line. In this role,operationsdrive smooth technology transferand ramp toin process transfer topilot production linewill be critical to a successful and efficientfab ramp-up.
Responsibilities:
and trainonexistingR&D processes andtransferknowledge to pilot production line
Create acomprehensivechecklistto ensuresuccessful transfer of processesand materials
Collaborate with R&Dandproductionprocess, integration,operationsand hardware teams to ensurecompleting the checklist on time to meet timeline needed to start HVMoperations
Track and manage schedules, deliverables, and risks for technology transfer and production milestones.
Coordinate trainingwith R&D transferengineers
Support tools and process qualifications at HVM site
Qualifications:
Strong understanding ofsemiconductormanufacturing processesand industry standardsincluding deposition, etch, lithography and metrology
Comfortable working across time zones, collaborating with remote teams, and supporting factory-side execution
Disciplinetracking and driving deliverables to completion
Flexibility to travel back and forth betweenSouth EastAsia and the USA
Work Location:
These jobs might be a good fit

Share
Key Responsibilities
Improve current generation plasma activation technology for hybrid bonding and develop next generation plasma technology and process
Design and execute experiments to study various types of plasma and their processes to understand their interaction with bonding surfaces. Analyze data to identify the key and common factor(s) of plasma that contributes to the strongest activation for hybrid bonding.
Optimize process and/ or drive CIPs to improve current generation plasma chamber. Identify the most suitable plasma technology and conduct CnF tests to define requirements for next generation chamber.
Deep dive with local & global engineering teams to prototype next gen chamber based on defined requirements. Evaluate proto chamber for hybrid bonding process, propose innovative solutions, and drive engineering optimization.
Plasma technology & process subject-matter expect to guide account/field teams on tough plasma technical issues in terms of process and physics.
Functional Knowledge
Good understanding of plasma physics and processes is essential.
Practical background on any types of plasma technology and its characterization is needed.
Familiar with common plasma characterization tools (such as OES, ion sensor, RGA, thickness measurement etc.) and methodology.
Knowhow to analyze surface characterization results (XPS, TEM, phase analysis, SIMS, EELS, etc) is a strong plus.
Any backgrounds of WoW or CoW bonding is a bonus.
Opportunities
On-job training on CoW hybrid bonding processes and challenges.
Developing a state-of-the-art integrated hybrid bonder and play a part in this historical industrial inflection from micro-bump/TCB to hybrid bonding. Working with subject-matter experts in various areas around the globe on plasma product development.
Technical training on/ exposure to up & downstream integration processes and interaction with hybrid bonding
Requirements
Engineering or science university educational background.
> 2 years experiences on plasma HW/ process development preferred.
10% travel commitment to the US (California), Taiwan, Korea or Europe
Working Location
Science Park II, Singapore
These jobs might be a good fit

Share
Key Responsibilities
Improve current generation plasma activation technology for hybrid bonding and develop next generation plasma technology and process
Design and execute experiments to study various types of plasma and their processes to understand their interaction with bonding surfaces. Analyze data to identify the key and common factor(s) of plasma that contributes to the strongest activation for hybrid bonding.
Optimize process and/ or drive CIPs to improve current generation plasma chamber. Identify the most suitable plasma technology and conduct CnF tests to define requirements for next generation chamber.
Deep dive with local & global engineering teams to prototype next gen chamber based on defined requirements. Evaluate proto chamber for hybrid bonding process, propose innovative solutions, and drive engineering optimization.
Plasma technology & process subject-matter expect to guide account/field teams on tough plasma technical issues in terms of process and physics.
Functional Knowledge
Good understanding of plasma physics and processes is essential.
Practical background on any types of plasma technology and its characterization is needed.
Familiar with common plasma characterization tools (such as OES, ion sensor, RGA, thickness measurement etc.) and methodology.
Knowhow to analyze surface characterization results (XPS, TEM, phase analysis, SIMS, EELS, etc) is a strong plus.
Any backgrounds of WoW or CoW bonding is a bonus.
Opportunities
On-job training on CoW hybrid bonding processes and challenges.
Developing a state-of-the-art integrated hybrid bonder and play a part in this historical industrial inflection from micro-bump/TCB to hybrid bonding. Working with subject-matter experts in various areas around the globe on plasma product development.
Technical training on/ exposure to up & downstream integration processes and interaction with hybrid bonding
Requirements
Engineering or science university educational background.
> 2 years experiences on plasma HW/ process development preferred.
10% travel commitment to the US (California), Taiwan, Korea or Europe
Working Location
Science Park II, Singapore
These jobs might be a good fit

Share
What We Offer
Program ownership in development, oversight and execution of Security programs and initiatives for Applied Material’s regional security function. This role requires a unique combination of security & crisis management expertise coupled with Strategic oversight, risk mitigation planning, cross-regional alignment and stakeholder engagement experience.
Key Accountabilities
Assist in the development of Applied Materials Security & Business Resiliency Program.
Implementation of Federal Security Programs, guard force services deployment, investigations, events security, emergency preparedness, and managing workplace violence prevention initiatives.
Budget / results accountability for assigned projects, programs and initiatives.
Works cross-functionally to develop KPI’s & SLA’s in areas of responsibility.
Development of security awareness and training programs.
Other initiatives / projects as needed
Leadership Skills Required
Security program development
Must have 100% credibility, objectivity and respect across all parts of the business
Ability to identify risk and define mitigation measures.
Willingness to challenge status quo, innovate and introduce new ideas
Understanding of differences in standards across geographies and cultures
Proactive mindset.
Build relationships with key stakeholders and business leaders
Promote the Security function as subject a matter expert within Applied Materials
Ability to collaborate with other service functions (GIS, HR, Finance, Legal)
Professional Expertise/ Knowledge
Industry best practices and metrics defining operational performance
Experience collaborating with cross-functional teams around Security and business continuity program process implementation and emergency management – preferably in global corporation setting
Program management in global security domain
Knowledge of estimating and cost associated with various system applications
Experience
2+ years in a similar role within a multi-national corporate security team
Experience in program management / Security planning & initiatives
Former corporate security / law enforcement / military experience highly desired
Skills
Service-oriented approach
Excellent organizational skills
Solid decision-making and judgment
Excellent presentation skills
Engaging communicator with ability to influence the leadership
Ability to work within a matrix environment with cross-functional collaboration
Education
Bachelor’s Degree in a related field required, Master’s Degree in a related field is a plus.
No. of Direct Reports
10 or less
Work Location
Upper Changi
These jobs might be a good fit

Share
Key Responsibilities
Functional Knowledge
Business Expertise
Leadership
Problem Solving
Impact
Interpersonal Skills
Education:Bachelor's Degree
Experience:15+ Years
This position may require certified ISO14001, ISO18001 internal auditor. Certification of Work safety and health officer; Certification of Fire Safety Manager.
Full timeAssignee / RegularThese jobs might be a good fit

Share
What We Offer
Bangalore,IND, Singapore,SGPAs a Customer / Field Service Engineer Leader, you will play an integral role in supporting the first private semiconductor FAB in India and in building the semiconductor ecosystem within the country. This position offers the prospect of advancing your career alongside the industry while establishing a high-performing team from the ground up.
To learn more about life as a Field Service Engineer, visit the
Responsibilities
Building the Organization: Responsible for creating the Field Service Organization, which includes hiring, onboarding, and upskilling talent to meet business requirements.
Leadership: Provides direction, coaching, and development for team members.
Problem Solving: Identifies and resolves technical, operational, and organizational issues.
Customer Relationship Management: Maintains and develops relationships with customers.
Operational Management: Manages financial, manpower, and operational requirements.
Communication: Effectively communicates business progress, goals, and updates.
Safety Practices: Ensures appropriate safety practices among team members.
Quality Improvement: Promotes processes to reduce cycle time and drive continuous improvement.
AdditionalRequirement (JobLocation)
Domain Skills
Sound Industrial Engineering practices related to the Semiconductor Domain (e.g., preventive and corrective maintenance).
Comprehensive understanding of the semiconductor industry, wafer FAB equipment, and chip manufacturing processes.
In the absence of semiconductor domain experience, an equivalent background in biotechnology manufacturing or pharmaceutical manufacturing is preferred.
Experience- 15+ Years
Bachelors/Masters in Engineering or Equivalent. Preferably in Mechanical, Electrical, Mechatronics, Industrial, Chemical andMetallurgy.
Additional Certifications complementing the Semiconductor, Pharma or Biotechnology domain will be a value add.
These jobs might be a good fit

Share
Advanced Packaging Process Development
Define and implement process flows for panel-level packaging and other advanced panel technologies.
Drive material selection and compatibility studies for large-format form factors.
Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.
Develop innovative solutions as part of proven track record of significant technology contributions. Recognized internally (across Business Units) as one of the limited number of technical experts in their field of expertise
Conceive and implement new technology, normally named as primary inventor on numerous critical patents and recognized through awards and/or published papers within the last five years.
Leads and collaborates to contribute to the development of new principles and concepts. Guides less experienced engineers in utilizing techniques to define methods and new technologies and apply them on unusually complex systems. Involved in judging the approach and verifying the validity of technical strategies.
Functional Knowledge
Optimize thin film deposition techniques such as Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD) (Including PECVD for low-temperature applications), Atomic Layer Deposition (ALD) for atomic-scale control and high-k dielectrics.
Electrochemical Deposition (ECD): For metal layers in advanced packaging.
Cross-Functional Collaboration
Works with business unit in technology development and transfer to customers including customized process development. Plans unit process sequence based on customer requirements. Negotiates process specifications and service offerings with customers. Takes ownership of delivering the required solution to the customers that meets specification.
Serves as the customer expert across a broad range of products. Plays a key role in defining product strategy and identifying gaps. Provides feedback to business unit heads on process and hardware improvements to meet customer roadmap requirements.
Work closely with design, reliability, and materials teams to ensure manufacturability and performance.
Support technology transfer from development to high-volume manufacturing.
Provides oversight of customer demos, including defining demo conditions and analyzing results.
Data Analysis and Continuous Improvement
Analyze process data for trend identification and optimization.
Drive continuous improvement initiatives for unit level process and cycle time improvement.
Conduct root cause analysis for defects and implement corrective actions to improve yield and reliability.
Within safety guidelines design, perform, collect data, analyze and compile reports on unusually complex engineering experiments and provides solutions which are highly innovative and ingenious.
Requirements
Bachelor’s degree with 15 years of experience, Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field.
Expertise in thin film deposition techniques and dielectric etch and panel packaging process integration .
Experience with advanced packaging technologies such as fan-out panel-level packaging (FOPLP), substrate technology and wafer Back-end technology.
Knowledge of industry standards and best practices in semiconductor packaging.
Strong understanding of semiconductor packaging technologies and process flows.
Strong knowledge of process characterization and troubleshooting.
Excellent problem-solving skills and ability to work in a fast-paced environment.
Ability to work in a cleanroom environment
Excellent communication skills
Work Location
Science Park II (Moving to Tampines in end 2026)
These jobs might be a good fit