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Principal Ic Package & Assembly Technology jobs at Amazon in Israel, Haifa

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Israel
Haifa
3 jobs found
08.09.2024
A

Amazon Principal IC Package & Assembly Technology Israel, Haifa District, Haifa

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Description:
Product development and manufacturing:– Assume full ownership of mechanical and thermal performance of Annapurna ICs.– Work with Assembly, Test and Logistics to define work flows at OSATs (focus on Fab/assembly/test...
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04.09.2024
A

Amazon IC Package & Assembly Technology Engineer Israel, Haifa District, Haifa

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Description:
Evaluation of packaging and assembly technology roadmap aligned to Annapurna product roadmap– Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurna’s products.– Engage with...
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03.09.2024
A

Amazon Principal Software Engineer ENA Israel, Haifa District, Haifa

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Description:
DESCRIPTIONENA firmware is responsible for network interfaces’ management, hardware resources configurations, hardware network acceleration settings, packet processing, and interfacing with the host operating system and virtualization layers.The Principal Software Engineer...
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Limitless High-tech career opportunities - Expoint
Description:
Product development and manufacturing:– Assume full ownership of mechanical and thermal performance of Annapurna ICs.– Work with Assembly, Test and Logistics to define work flows at OSATs (focus on Fab/assembly/test...
Full job details
Find your dream job in the high tech industry with Expoint. With our platform you can easily search for Principal Ic Package & Assembly Technology opportunities at Amazon in Israel, Haifa. Whether you're seeking a new challenge or looking to work with a specific organization in a specific role, Expoint makes it easy to find your perfect job match. Connect with top companies in your desired area and advance your career in the high tech field. Sign up today and take the next step in your career journey with Expoint.