Principal Ic Package & Assembly Technology jobs at Amazon in Israel, Haifa
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Job title (1)
Israel
Haifa
6 jobs found
20.09.2025
A
Amazon Signal Integrity & IC Package Design Israel, Haifa District, Haifa
Basic Qualifications 3+ years of non internship professional software development experience 2+ years of non internship design or architecture (design patterns, reliability and scaling) of new and existing systems experience...
AWS Utility Computing (UC) provides product innovations — from foundational services such as Amazon’s Simple Storage Service (S3) and Amazon Elastic Compute Cloud (EC2), to consistently released new product innovations...
Why AWS. Diverse ExperiencesAmazon values diverse experiences. Even if you do not meet all of the preferred qualifications and skills listed in the job description, we encourage candidates to apply....
Deep dive into electrical IPs, integrated into the DIE;. I/O ring design and close work with Backend team on floor-planning all I/O interfaces at the DIE level. Lead test studies...
BASIC QUALIFICATIONS 3+ years of engineering team management experience 7+ years of engineering experience 8+ years of leading the definition and development of multi tier web services experience Knowledge of...
DESCRIPTIONAs SDE II here, you will build, scale, monitor, and optimize systems within AFFS. You will interface with several teams including Retail Systems, Marketplace Systems, Digital Systems, Web services, Financial...
Basic Qualifications 3+ years of non internship professional software development experience 2+ years of non internship design or architecture (design patterns, reliability and scaling) of new and existing systems experience...
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