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Google Senior Packaging Research Development Engineer United States, California 992289879
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Minimum qualifications:
Preferred qualifications:
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
- 6 years of experience working in a Research and Development packaging technical environment.
- 5 years of experience in Micro Electro Mechanical Systems (MEMS)/semiconductors advanced packaging including design, development, and testing.
- 5 years of experience in characterization of reliability and yield of advanced electronics packaging hardware.
- 5 years of experience in package techniques including 3D integration, wire bonding, bump bonding, land grid array, through-silicon vias, electrical contacts, micro machining.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
- Experience building and managing vendor supply chain.
- Experience with superconducting circuits or quantum computing hardware such as superconducting qubits, spin qubits, or trapped ions.
- Experience with microwave devices such as transmission lines, waveguides, resonators or antennas.
- Experience with cryogenic vacuum environments, thermal cycling and related challenges.
- Experience guiding high-precision research and development packaging development efforts and projects.
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