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Principal Engineer Advanced Packaging jobs at Intel in United States, Oregon, Hillsboro

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Company (1)
Job type
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United States
Oregon
Hillsboro
95 jobs found
18.05.2024
I

Intel LTD Advanced Device Development Engineer United States, Oregon, Hillsboro

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Description:
Set advanced device performance targets for Process Design Kit releases and Interface with Design and Foundry partners to address circuit-level issues. Assess Silicon-to-Simulation health and readiness for High Volume Manufacturing....
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Yesterday
I

Intel LTD Advanced Interconnect Device Engineer United States, Oregon, Hillsboro

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Description:
Define Interconnect performance targets for Process Design Kit releases, interface with design teams to understand Interconnect performance impact on overall technology entitlement commits. Use Statistics, Data Mining, and other data...
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Yesterday
I

Intel LTD Staff Advanced Device Development Engineer United States, Oregon, Hillsboro

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Description:
Set advanced device performance targets for Process Design Kit releases and Interface with Design and Foundry partners to address circuit-level issues. AssessSilicon-to-Simulationhealth and readiness for High Volume Manufacturing. Define robust...
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Yesterday
I

Intel Principal Semiconductor Research Engineer United States, Oregon, Hillsboro

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Description:
15+ years of experience in research with the electronic, magnetic/spintronic and ferroelectric materials and their simulation/modeling. Experience in the exploration of significantly more energy efficient devices than the complementary MOSFET...
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13.05.2024
I

Intel Principal Engineer Equipment Development United States, Oregon, Hillsboro

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Description:
Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design...
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Yesterday
I

Intel SPICE Modeling Engineer United States, Oregon, Hillsboro

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Description:
- Semiconductor devices. - Device simulation or transistor modeling/design or circuit simulation or compact model development. RF device modeling or RF design background. Statistical Modeling and Machine learning. Python Programming...
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Yesterday
I

Intel Module Development Engineer United States, Oregon, Hillsboro

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Description:
Creating 2D and 3D CAD of collaterals and other equipment. Generating CAD Drawings with accurate GD and T callouts. Performing mechanical design analysis and simulations (Mechanical, Thermal, and Fluid). Documenting...
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Find your dream job in the high tech industry with Expoint. With our platform you can easily search for Principal Engineer Advanced Packaging opportunities at Intel in United States, Oregon, Hillsboro. Whether you're seeking a new challenge or looking to work with a specific organization in a specific role, Expoint makes it easy to find your perfect job match. Connect with top companies in your desired area and advance your career in the high tech field. Sign up today and take the next step in your career journey with Expoint.