Expoint – all jobs in one place
Finding the best job has never been easier
Limitless High-tech career opportunities - Expoint

Apple GPU Top Level Physical Design Engineer F 
United States, West Virginia 
964447476

09.09.2025
This role requires a mix of strategic engineering along with hands-on, technical work, being responsible for implementing complete chip design from netlist to tapeout, and having hands on experience in physical design and large chip integration.
  • • Collaborate with FE team to understand chip architecture and drive physical aspects early in design cycle.
  • • Contribute to innovation with the physical design team, and develop methodologies and “best known methods” that will enable outstanding GPU design.
  • • Develop PD guidelines and checklists and drive execution. Be the focal point for place and route integration at the top level • Plan short and long-term work and goals with awareness of dependencies between different domains like top, STA, block place and route.
  • • Reach new career highs as you resolve design and flow issues related to physical design, identify potential solutions and drive execution.
  • • If you are a confident problem solver who thrives under pressure to find new, creative solutions, we are excited to hear from you!
  • MSEE or equivalent is required.
  • Deep experience with all aspects of ASIC integration including Floorplanning, Clock & Power distribution, global signal planning, I/O planning & hard IP integration.
  • Knowledge of issues such as multiple voltage and clock domains, ESD strategies, mixed signal block integration, and package interactions.
  • Familiar with hierarchical design approach, top-down design, budgeting, timing and physical convergence.
  • Depth of expertise on integrating IP from both internal and external vendors and be able to specify and drive IP requirements in the physical domain.
  • Experience with large subsystem designs (>20M gates) with frequencies in excess of 1GHz applying brand-new technologies.
  • Familiar with various process related design issues including Design for Yield and Manufacturability, multi Vt strategies and thermal Mgt.
  • From a CAD tool perspective, experience with Floorplanning tools, P&R flows, global timing verification and Physical Design Verification Flows is required.