Develop and implement new manufacturing processes for PCBA production, including SMT, through-hole, and other assembly technologies
Lead early build activities, including prototyping, pilot production, and new product introductions, to ensure successful transition to production
Collaborate with design engineers to ensure that designs are manufacturable and meet production requirements
Develop and optimize process parameters, including solder paste printing, pick-and-place, reflow, and inspection, to improve yields and reduce costs
Troubleshoot production issues and implement corrective actions to improve yields and reduce costs, using data analysis and problem-solving skills
Develop and maintain documentation, including work instructions, control plans, and process failure modes effects analysis (PFMEA) documents, to ensure process control and quality
Work with suppliers, equipment vendors, and internal stakeholders to ensure that components, materials, and equipment meet manufacturing requirements, and to identify opportunities for process improvement and cost reduction
What You’ll Bring
3+ years of experience in PCBA manufacturing, SMT process engineering, or related field
Strong knowledge of SMT and soldering processes, including experience with IPC-A-610 and IPC-J-STD-001 certifications
Experience with SMT equipment and process optimization, including solder paste printing, component placement, reflow profiling, SMT inspection and testing methods, such as AOI and X-ray inspection
Experience with lean and six sigma principles, including proficiency in tools such as DMAIC, Root Cause Analysis (RCA), Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), Process Capability Analysis (PCA), statistical process control (SPC), and Kaizen