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Apple IC Packaging Engineer - Korea South Korea, Seoul 955013152
25.03.2025
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Description
- Work with cross-functional teams and lead package integration and architecture efforts. - Work with 3rd party and OSATs to bring IC packaging solutions from concept to mass production. - Work to bring innovative packaging solutions from concept to mass production, including package, module and technology development.- Conduct and approve packaging proposals, designs, schematics, process flows, risk assessments, technical specifications, reliability requirements, data collection, and analysis.
Minimum Qualifications
- Bachelors and 10+ years or relevant industry experience in Semiconductor Packaging Design, Process and New Product Introduction.
- Must have hands-on experience and expertise on IC packaging.
Preferred Qualifications
- Typically requires at least 5+ years of experience in Semiconductor Packaging Design, Process and New Product Introduction. Must have hands-on experience and expertise on IC packaging.
- Strong knowledge and experience in IC packaging, SIP Module packaging, single die packaging and heterogeneous package integration.
- Knowledge and experience package assembly process, materials, and equipment. Experience driving development of new enabling technology and roadmaps.
- Strong IC packaging materials background including characterization and failure analysis.
- Problem solver with strong engineering physics. Willing to tackle tough problems.
- Ability to work independently and work with multi-functional teams.
- Proven track record working with internal teams or vendors to execute introduction of new packaging and technology solutions.
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