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What you'll be doing:
Responsible for leading end-to-end memory quality
Coordinate memory component FA(Failure Analysis) activities including RA(Root-cause Analysis), CA(Corrective Action), CIP(Continuous improvement plan) to improve the quality of memory products.
Work closely with memory suppliers and internal teams to assure new memory product readiness and ensure performance meets the key quality and reliability metrics.
Collaborate with engineering organizations to resolve memory failures.
Lead PCN(Product Change Notification) and provide risk assessments for proposed changes and represent supplier’s change in the CRB(Change Control Board) meetings
Lead quality audits at supplier site to ensure supplier quality practice
What we need to see:
MS/BS in engineering or equivalent experience
8+ years significant experience in memory industry
Knowledge of DRAM operation and understanding key AC/DC parameters in datasheet
Strong understanding of memory wafer fab process, package assembly process, testing, and firmware.
In-depth knowledge of memory quality and reliability concept including qualification report and JEDEC reliability standard
Familiar with physical FA technique such as C-SAM, SEM, TEM, FTIR, ASE, Hot Spot Analysis
Supplier quality management experience and a deep understanding of problem-solving tools including 8D principle and statistical process control principles
Experience with data analysis using Excel, Minitab, or JMP
Dedicated and able to work with minimum supervision
Proficient English (both written and spoken) and excellent communication skills.
Ways to stand out from the crowd:
Direct working experience with major memory suppliers
Extensive knowledge and hand-on experience on HBM and LPDDR quality improvement and failure analysis
Comprehensive knowledge of CoWoS process
You will also be eligible for equity and .
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