- BS/MS in Electrical or Computer Engineering
- Min 15+ years of experience in semiconductor design.
- Great communication, collaboration and teamwork skills and ability to contribute to diverse and inclusive teams.
- Proven track record of implementing designs through synthesis, floorplanning, place and route, extraction, timing, and physical verification.
Preferred:
- Large SoC/CPU/IP design tape-out experience in the latest foundry process nodes.
- Led PD teams to deliver multiple PD partitions integrated in a subchip/subsystem, having excellent project management skills and ability to juggle multiple projects at once.
- Strong understanding of constraints generation, STA, timing optimization, and timing closure.
- In-depth understanding of design tradeoffs for power, performance, and area.
- Hands on experience with CTS and global clock distribution methods in multi-voltage, multi-clock, multi-domain, and low power designs.
- Experience in EDA tools such as Primetime, StarRC, Design Compiler, ICC, Fusion Compiler, Innovus etc.
- Experience and knowledge of formal equivalency checks, LEC, LP, UPF, reliability, SI, and Noise.
- Experience in driving/contributing/influencing PD Methodology will be required. Overall know how of PD-TFM, exposure and some hands-on experience with PD flows bring up/setup/flow flush and PD methodology will be a bonus.
- Strong problem-solving and data analysis skills.
- Automation skills using scripting languages such as Perl, TCL, or Python.
- Technically leading/guiding a team of multiple PD engineers in order to deliver a Sub-Chip/SoC will be a big plus.
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.