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Process Engineers work across technologies such as: Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal and Implant.
Responsibilities
Participate in the creation of cutting-edge processes used to manufacture the most-advanced semiconductor chips, many of which are inside everyday electronic devices
Design, collect data, analyze and compile reports on complex process engineering experiments
Perform hardware characterization on a variety of systems
Measure film properties, organize data, and interpret data
Troubleshoot moderately complex problems, perform Root Cause Analysis and resolve moderately difficult process engineering issues
Generate internal documentation for products, presentations and technical reports
Requirements
Student must be pursuing a Bachelor’s degree program inMaterials Science and Engineering, Chemical Engineering, Physics or related fieldfrom an accredited college or university, with an expected graduation date between December, 2025 and June, 2026
Must be in good academic standing, with a preferred a GPA above 3.0 on a 4.0 scale preferred
Ability to exercise judgment based on the analysis of multiple sources of information
Explains difficult or sensitive information; works to build consensus
Flexible and adaptable mindset who thrives in a results-driven culture
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