Qualcomm Thermal Engineer 

United States, Texas, Austin 

910414714

Job Area:

Engineering Group, Engineering Group > Systems Engineering

Position: Thermal Engineer

As an experienced(individual contributor), you will work closely with the platform team developing high-performance servers, collaborating with cross-functional teams, including packaging, electrical, mechanical, and component suppliers. You will be responsible for conducting thermal simulations, testing, and characterization to validate and improve thermal models and solutions for high-performance computing systems.

Key Responsibilities

• Perform die/package/system-level thermal modeling to analyze and optimize server package and system thermals.

• Support thermal design of packages and systems from concept through detailed design and manufacturing readiness.

• Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, packaging, system, and customer requirements.

• Conduct thermal testing to validate and improve thermal models and solutions, enhancing accuracy and robustness.

• Research thermal management materials and solutions for advanced electronics.

• Develop and maintain documentation, guidelines, and tools to support design processes and project success.

• Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers.

Minimum Qualifications

• Master’s degree in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.

• 5+ years of hands-on experience in thermal modeling within the high-tech industry.

• Strong background in heat transfer fundamentals, with a solid understanding of conduction, convection, and radiation.

• Proficiency with CFD modeling tools (e.g., Celsius EC, Flotherm, Icepak).

• Understanding of electronics cooling technologies (passive and active).

• Knowledge of packaging technologies, server design, and thermal management materials.

• Proven ability to work independently and collaboratively within a cross-functional team environment.

• Strong technical documentation skills and excellent written and verbal communication.

Preferred Qualifications

• Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.

• 10+ years of hands-on experience in thermal modeling within the high-tech industry.

• Understanding of OCP product designs and industry best practices.

• Engineering design and industry experience with high-end servers.

• Expertise in conducting CFD simulations with thermal modeling tools (e.g., Celsius EC, Flotherm, Icepak).

• Proficiency with thermal testing (e.g., DAQ, LabVIEW, thermocouples, airflow measurements, thermal chambers) for computer hardware.

• Proficiency in programming languages (e.g., Python, C/C++, MATLAB) for data analysis and tool development.

• Experience with CAD tools (e.g., SolidWorks, Creo).

Minimum Qualifications:

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Systems Engineering or related work experience.

Master's degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of Systems Engineering or related work experience.

PhD in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

$192,600.00 - $330,400.00