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Apple Assembly Integration Engineer United States, California, San Diego 895296754
28.03.2024
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Key Qualifications
- Experience in Semiconductor Packaging field.
- Working knowledge in materials characterization and analysis
- Solid understanding of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology.
- General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
- Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.
- Ability to work independently and solve projects with minimum supervision.
- Good engineering problem solving skills with strong engineering physics and fundamentals.
- Can use package design softwares, APD, Virtuoso, etc.
- Working knowledge in memory packaging.
- Good program management skill
Education & Experience
- BS and +10 years of relevant industry experience
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $161,700.00 and $284,900.00, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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