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Apple Advanced Package Development Engineer United States, California, Cupertino 874061184
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Key Qualifications
- Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch μ-bumps, hybrid bonds, TSVs, etc.
- Deep knowledge of electrical, mechanical and thermal properties of fab materials
- Strong expertise in Si Fab equipment and Fab Logistics Management
- Experience on advanced packaging for groundbreaking CMOS nodes
- Expertise on Si structure yield and reliability mechanisms and analyses
- Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis
- Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT
- Capable of independent R&D Work in a cross-functional team, driving vendors
- Excellent communication skills
- Experience in Si fab integration role and advanced packaging
Description
Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology development.
Education & Experience
BS and 10+ years of relevant industry experience.
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $170,700.00 and $300,200.00, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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