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Apple Advanced Package Development Engineer United States, California, San Francisco 874061184
06.06.2024
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Description
Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology development.
Key Qualifications
- Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch μ-bumps, hybrid bonds, TSVs, etc.
- Deep knowledge of electrical, mechanical and thermal properties of fab materials
- Strong expertise in Si Fab equipment and Fab Logistics Management
- Experience on advanced packaging for groundbreaking CMOS nodes
- Expertise on Si structure yield and reliability mechanisms and analyses
- Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis
- Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT
- Capable of independent R&D Work in a cross-functional team, driving vendors
- Excellent communication skills
- Experience in Si fab integration role and advanced packaging
Education & Experience
BS and 10+ years of relevant industry experience
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $170,700 and $300,200, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
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