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What you'll be doing:
Lead board/system SI design activities, PCB stack up design, material selection, design guide implementation, layout review, and post-layout analysis.
System-level signal integrity simulation of PCIE, LPDDR/DDR/GDDR, MIPI, HDMI, USB andother interfaces.
Analyze and optimize Power delivery network (PDN) on PCBs.
Work closely with Package and PCB Design teams crafting solutions for system SI/PI performance.
Work with Application Engineering supporting customer board designs.
TDR & VNA measurement for PKG/PCB material characterization and model correlation
What we need to see:
BS/MS in Electrical Engineering (or equivalent experience) with minimum 4 years of experience as a SI/PI engineer
Good understanding of electromagnetics, channel components and transmission line theory
Experience with design and implementation of one or more high speed electrical interfaces, such as PCIE, LPDDR/DDR/GDDR, MIPI, HDMI, USB etc.
Hands on experience with HFSS, Sigrity, Hspice or similar industry standard simulation tools
Experienced with Cadence Allegro PCB designer and Constraints Manager and or other PCB stack up designer tools.
Understanding of impacts of high-volume PCB manufacturing on channel signal integrity
Ways to stand out from the crowd:
Expertise in one or more of the high-speed interface SI/PI designs on any industry standard system platforms.
Exposure to package design, interface timing budgets and system modeling
Familiarity with high-speed transmitter, receiver design and various equalization schemes
Familiarity with various signaling schemes like NRZ, PAM4 is a plus.
You will also be eligible for equity and .
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