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Job Area:
Engineering Group, Engineering Group > Mechanical Engineering
Responsibilities include:
Creating and releasing 3D CAD designs and documentation
Electromechanical enclosure design of consumer mobile device, 6G infrastructure, IOT, and server test platforms.
Creating, sourcing, and sustaining mechanical assembly bill-of-materials.
Coordinating/sourcing prototype plastic, sheet metal, CNC machined mechanical assembly components including housings, heatsinks, antennas, mounts, chassis, etc.
Coordinating with suppliers, sourcing, and manufacturing staff to facilitate initial prototype and production builds.
Communicate and collaborate effectively with multi-disciplinary team members in various geographical regions.
Develop basic thermal analysis models of mechanical assemblies.
Effectively communicate and collaborate with multi-disciplinary teams across various geographical regions.
Work onsite minimum 4 days/week in the Qualcomm office in San Diego, CA
Engineer will interface with internal staff and outside suppliers in the fast-paced execution of a wide variety of multi-disciplined design projects.
Minimum Qualifications:
• Bachelor's degree in Mechanical Engineering or related field and 2+ years of Mechanical Engineering or related work experience.
Master's degree in Mechanical Engineering or related field and 1+ year of Mechanical Engineering or related work experience.
PhD in Mechanical Engineering or related field.
Preferred Qualifications:
• 4+ years of work experience with mechanical systems, equipment, analysis, packaging enclosures, or related work experience.
• 4+ years of work experience with design testing and/or prototyping.
• 4+ years of work experience with 3D CAD software (e.g., Creo).
• 2+ years of work experience in a role requiring interaction with senior leadership (e.g., Director and above).
Principal Duties and Responsibilities:
• Designs, analyzes, and builds mechanical hardware for chipset development platforms and products.
• Utilizes engineering modeling, simulations, and analysis software tools to drive design activities.
• Applies Mechanical Engineering knowledge and experience to troubleshoot and test electro-mechanical systems and packaging.
• Conducts feasibility testing on new and modified designs and evaluates the assembly process.
• Receives and/or develops requirements from other areas and ensures that designs meet the goals of the project.
• Interfaces with key customers, suppliers, and manufacturing to develop platforms and source parts.
• Creates detailed documentation for mechanical parts and assemblies.
Level of Responsibility:
• Works independently with minimal supervision.
• Decision-making may affect work beyond immediate work group.
• Requires verbal and written communication skills to convey information. May require basic negotiation, influence, tact, etc.
• Works within the prescribed budgetary objectives of the department.
• Has a great degree of influence over key organizational decisions.
• Tasks require multiple steps which can be performed in various orders; some planning, problem-solving, and prioritization must occur to complete the tasks effectively.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
:
$101,400.00 - $152,200.00
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