Intel Wafer Assembly CMP Module Development Engineer 

United States, Oregon, Hillsboro 

846708315

As wafer level assembly technology development (WATD) CMP Module Engineer, you are responsible for driving plating process technology development to enable best plating process to meet program needs. You will design, execute and analyze experiments to improve process efficiencies. You will engage closely with equipment suppliers to identify the hardware modification for better process outcome. You will develop new chemicals and processes to meet program needs. You will develop plating processes that sustainable for high manufacturing volumes, to demonstrate the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing via the Copy Exactly methodology. You will be responsible to install and qualify manufacturing capacity at the development site and audit installation/qualification and supervise first full loop at the production site. You will develop and sustain plating process in semiconductor fab manufacturing operations.

Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Requirements:

• PhD degree with 2+ years or Master degree with 4+ years of experience in Engineering, Materials science, Chemistry, Physics, or a closely related scientific STEM field.
• 4+ years of direct plating or related module engineering process/hardware technology development experience.
• CMP, any other FAB experience

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing BenefitsThis role will require an on-site presence.