Nvidia Senior Program Manager Chip Assembly Manufacturing Operations 

United States, California 

837748721

What You Will Be Doing:

• Bring new products and new technologies to high volume manufacturing

• Deliver datamation solutions for enhanced decision making

• Manage supplier performance evaluation matrix and keep it updated based on changing business needs

• Drive continuous improvement in manufacturing yield, cycle time and product quality/reliability

• Lead change control through qualification and notification

• Lead non-conforming material disposition

• Manage BOM supply chain and optimize sourcing solutions for best capacity and cost

What We Need To See:

• Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, Chemical Engineering fields (or equivalent experience)

• 12+ years of validated experience in Flip Chip semiconductor packaging design, process and materials development. Direct experience in advanced assembly technologies such as 2.5D/3D packaging, Photonics packaging experience is desirable

• Solid technical knowledge of materials, process, package design and equipment technologies in substrate, bumping, and chip assembly

• Strong skills in project management and supplier management

• Solid understanding of quality control, statistics process control, gage R&R and DOE techniques

• Good knowledge of packaging industry and its supply chain

• Excellent written and verbal communication skills

• Experience working with multi-functional teams across the world