Western Digital Principal Engineer Packaging Engineering 

Canada, British Columbia, Area H (Cultus Lake/Columbia Valley) 

828270613

But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data.

Job Description :

• Strong knowledge in SIPI fundamentals i.e. IL, RL, Xtalk, Zpdn/Ztargets, TDR and SIPI debugging skills
• Must be aware of design techniques used to compensate channel losses for HS interfaces
• Proficiency in creating and simulating systems using IBIS/IBIS-AMI, CPM, HSPICE/Netlist and S-parameter models
• Can drive the system timing budget and influence hardware and IO design for higher toggle speed and BW
• Evaluate the impact of channel loss, reflection, crosstalk, and supply noise on overall system performance
• Expert in package and PCB extraction tools (PowerSi, Sigrity, Hyperlynx, Ansys HFSS/SiWave)
• Knowledge of package/PCB stack-up design and layout improvement techniques
• Experience in decoupling capacitor placement and its optimization to improve Zpdn
• Hands-on experience in ADS to run transient and frequency domain analysis
• Demonstrate familiarity with various High-Speed interfaces such as PCIE, USB, UFS, SATA, DDR, LPDDR, GDDR, HBM, NAND etc

Others :

• Strong technical, written and verbal skills required to prepare/present his/her own work independently to the internal/external customers
• Ability to drive initiatives through innovation, handle discussions with all stakeholders, take data driven decision, and meet deadlines with their own
• Automation & scripting(Python, Perl) knowledge is a plus

• Bachelors, Masters or PhD in relevant field
• 5-8 years of experience in Signal and Power Integrity domain