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What you'll be doing:
Be part of a cross-business-unit team and own the high-speed IP integration.
Build a Chiplet floorplan layout design from early assembly/planning through implementation and signoff.
Work closely with partition owners and Full Chip STA engineers to assure high quality and timely convergence.
Define and implement efficient, high-quality Chiplet level physical design tools, flows, and methodologies.
Gain hands-on experience implementing the partition-level BE design (RTL2GDS).
What we need to see:
Great teammate
BSEE / MSEE or equivalent experience.
8+ years experience in physical design
Experience in unit and top-level floor planning, bump and RDL layout, full-chip clock tree, power grid planning, and DRC/LVS.
In depth knowledge of physical design flows and methodologies (PNR, STA, physical verification).
Deep understanding of all aspects of Physical construction and Integration.
Knowledge in Physical Design Verification methodology LVS/DRC.
Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.)
You will also be eligible for equity and .
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