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Google Chip Packaging Technologist United States, California, Sunnyvale 796160932
06.03.2025
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Minimum qualifications:
Preferred qualifications:
- Bachelor's degree in Materials, Mechanical, Electrical Engineering, a related engineering field, or equivalent practical experience.
- 5 years of experience with advanced packaging technologies for HPC applications, including 2.5D/3D packaging.
- Experience with package integration or a similar role.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture, or a related field.
- Experience with HBM memory packaging and its integration into the packaging solution.
- Experience with high-volume manufacturing processes and yield improvement.
- Experience with assembly houses or wafer foundries.
- Understanding of multidisciplinary interactions between packaging technology, chip package electrical design, thermal and mechanical performance and manufacturability/reliability.
- Understanding of advanced foundry process nodes and their interactions with package reliability and different package technologies.
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