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Annapurna Labs, as part of AWS, is looking for a Thermal Design Engineer to help define, shape, and integrate solutions for the next generation of our cloud platforms. In this role, you will drive innovation by developing advanced cooling techniques to enhance AWS products and services. Your work will involve conducting FEA simulations, collaborating with a wide range of vendors, and designing experiments to validate your concepts. As a key member of a multidisciplinary team, you will play a pivotal role in shaping the future of AWS products.
Key job responsibilities
* Develop thermal solutions for K2 products, air and liquid cooled.
* Review thermal designs done by partners.
* Design and execute thermal experiments in the lab.
* Debug thermal related failures.
* Lead several research/development projects in parallel.About the team
Diverse Experiences
AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn’t followed a traditional path, or includes alternative experiences, don’t let it stop you from applying.
Why AWS?Inclusive Team CultureMentorship & Career Growth
We’re continuously raising our performance bar as we strive to become Earth’s Best Employer. That’s why you’ll find endless knowledge-sharing, mentorship and other career-advancing resources here to help you develop into a better-rounded professional.
Work/Life BalanceEarly Career Talent
When you join Amazon Web Services as a student or recent graduate, you’ll have the chance for your voice to be heard and amplified. That’s because our teams are looking to learn as much from you as you’ll learn from them. Whether you’re graduating with a high school or equivalent diploma, associate degree, bachelor’s degree, MBA, or PhD, we offer a range of early career opportunities across the globe.
B.Sc/M.Sc in Mechanical Engineering or Aerospace Engineering.
At least 10 years experience as Thermal Engineer in electronics industry
Exceptional knowledge of heat-transfer and CFD analysis using the most advanced FEA tools like FloTherm/FloEFD or IcePak/Fluent.
Proven hands on experience in thermal lab with concluding and designing experiments.
Deep theoretical basis in heat transfer, fluid dynamics and thermodynamics disciplines.
Strong knowledge of thermal design of electronic packaging, from component level to rack level
Experience with liquid cooling design, in all aspects of heat transfer, flow network modeling and mechanical design
Experience with thermal management of electronics on system level, rack level through data center level
Mechanical design skills using common CAD software like Siemens NX, Invetor or Creo
Experience working with environmental and reliability standards in ASHRAE, ECMA, IEC, ART-ISO, NEBS etc.
Good knowledge of leading standards in electronics industry, such as PCI, OCP, JEDEC etc.
Proven experience of project management
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