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Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.
JOB DESCRIPTION:
• Responsible for defining and tracking characterization test plans through 3D NAND memory development cycles from first silicon through internal qualification and mass production.
• Define characterization test methodology and write characterization test programs on Memory ATE (Automated Test Equipment) Teradyne and Advantest test systems.
• Right tools as necessary to assist silicon debug, validation and test correlation with other test engineering teams across global sites.
• Characterization of all 3D NAND memory technology and designs for logic / functionality, performance, power consumption, timing and some aspects of reliability.
• Maintain close communication with the local design team as well as applications engineering team to ensure the design is meeting both internal and external specifications.
• Prepare and present data to the design team on validation / statistics and work closely to drive issues through closure.
• Customize test coverage and define new test strategy for OEM specific customers.
• Provide test engineering support for design debug activity and failure analysis.
• Silicon micro-probing skills on micro manipulator will be necessary.
REQUIREMENTS
B.Tech / M.Tech
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