Qualcomm FY24 Summer Intern-Hardware engineer 

China, Shanghai 

771451180

Job Area:

Interns Group, Interns Group > Interim Engineering Intern - HW

Main Responsibilities:

IPS Shanghai Team is HW R&D in QCOM, responsible for QC Chipset verification and refrence platform design. We have Baseband, RF, System, Validation, eCAD, mCAD, 6 sub teams. Focus on:

1. Chipset reference design

2. Chipset verification platform design

3. Chipset solution HW test

4. Bugfix and Optimization

Skills / Experience Required:

Basic Request

1. Familiar with Analog and Digital Circuit, including Amplifier, LDO &DCDC, ADC&DAC, etc.

2. Familiar with Wireless and Microwave, including impedence, Smith chart, PA, etc.

3. Know High speed signal design, including stripe line, micro stripe line, Z0, etc.

4. Know Wireless Communication, including Cellular Modem, Modulization, SPSP, Coding, etc.

5. Know VLSI, include CMOS Logic, IO model, Timing, etc.

Preferred:

1. Experience in RF circuit design or debug

2. Experence in Power circuit design or debug

3. Experence in applicaiton design of MCU or SoC

4. Strong speaking English. CET-6 or equal

Education Requirements (Degree Major, GPA, Courses):

Electrical Engineering, Communication and Computer Science or related

Bachler or above

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.