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Intel NM DMO Dry Etch Development Engineer United States, New Mexico, Albuquerque 764178654
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As the Dry Etch Development Engineer, you will be responsible for but not limited to:
Develop Dry etch processes enabling manufacture of innovative device architectures coupled with the realization of these architectures.
Design, execute, and analyze experiments necessary to meet design/electrical specifications for their process.
Collaborate with cross module teams, integration, device and yield teams to develop robust dry etch solutions to meet technology requirements.
Define roadmaps to meet requirements, goals and milestones for a new technology process.
Work effectively with the equipment supplier to identify next generation tooling solutions, propose and evaluate hardware modification of existing toolsets for continuous improvements.
Drive fungibility of tools across different technologies.
Partner with Process Integration and other modules to enable device structures.
Drive model-based problem solving and failure model analysis.
Development of novel process recipes.
Drive improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment, and operating personnel.
Define and establish flow, procedures, and equipment configuration for the module.
Train production/receiving process engineers, engineering, and manufacturing technicians for transfer to other factories.
Transfer process to high volume manufacturing and provide support in new factory startup as well as install and qualification of the new production lines.
The ideal candidate should exhibit the following behavioral traits:
Solid understanding of plasma physics and transport/surface phenomena.
Willingness to work independently with limited direction, as well as in a team environment across functional and organizational boundaries is required.
Willingness to understand material characterization techniques such as scanning electron microscope (SEM), transmission electron microscopy (TEM), fourier transform infrared (FTIR), SIMs etc.
Strong written and verbal communication. Ability to communicate well with all levels of the organization.
Detail oriented problem solver, sense of urgency and commitment to achieve targeted goals.
Demonstrated capability working in a high performing team culture which include: excellent teamwork and leadership skills, demonstrated problem solving and prioritization skills, and participating in Continuous Improvements through applying LEAN principles.
Full time onsite required during training, estimated 6 months. After training: hybrid “work from home” to be defined by manager and employee but continued onsite will be required.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
Candidate must possessat least oneof the following 3 degrees; plus, the years of experience required for each degree in the areas specified below:
BS in Electrical Engineering, Chemical Engineering, Physics or related fields with 6+ years of industry experience in development and design of Dry etch process OR
MS in Electrical Engineering, Chemical Engineering, Physics or related fields with 4+ years of industry experience in development and design of Dry etch process OR
PhD in Electrical Engineering, Chemical Engineering, Physics or related fields with 2+ years of industry experience in development and design of Dry etch process.
Preferred Qualifications:
Experience in data analysis and statistical process control.
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