Qualcomm Thermal Engineer Principal 

United States, California, San Diego 

751189321

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

Qualcomm’s Hardware Systems is seeking a seasoned Thermal Engineer to contribute to the continued success of our industry-leading portfolio of chipset solutions. The qualified individual will be contributing to innovative solutions resolving complex thermal management challenges supporting various BUs and product lines. He/She will apply analytical skills on development of advanced thermal architecture solutions for a variety of hardware platforms including server, laptop, automotive, IOT, and mobile.

• Thermal Engineering leader to support multiple projects from concept to post-production across various business units within Qualcomm.

• Lead package and system cooling architecture through simulations while working with various non-thermal disciplines.

• Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, lead thermal design reviews and presentations, and lead and mentor small size thermal teams.

• Conduct research on advanced thermal management solutions applicable to complex electronics hosted across a spectrum of platforms from mobile to server level equipment.

• Develop custom SW solutions to automate thermal modeling and test.

• Perform thermal simulations utilizing CFD tools on various platforms.

• Design, set up, run, and deliver results for various thermal experiments.

Requirements

• Thorough understanding of electronics cooling technologies; passive, active, and liquid cooling.

• Experience in thermal management of servers, laptops, and automotive electronics is highly desirable.

• Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan.

• Experience in design, selection, and implementation of thermal management materials in consumer and industrial electronics.

• Academic or industry exposure to 2.5/3D packaging is highly desirable.

• Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for data analysis & tool development.

• Expertise in conducting CFD simulations and proficiency in SW tools such as ANSYS-Icepak.

• Capability to design and execute thermal tests within a laboratory environment, and hands on experience with airflow and temperature measurements equipment.

• Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable.

• Excellent presentation, negotiation, and communication skills.

• Ability to clearly communicate complex technical content in written and verbal formats.

• 10+ years of industry experience in electronics cooling.

• Some experience with AI/ML concepts, algorithms, and methodologies is a plus."

Education

• Required: MS in Mechanical Engineering

• Preferred: PhD in Mechanical Engineering

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range:

$189,000.00 - $284,000.00