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Job Area:
Engineering Group, Engineering Group > Hardware Engineering
Minimum Qualifications:
• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
Preferred Qualifications:
Experience in Semiconductor sample preparation using Focused Ion Beam (FIB) to create microscopy lamella for Transmission Electron Microscopy (TEM)
Experience in Transmission Electron Microscopy (TEM) Analysis including EDS.
Fundamental knowledge of Fault isolation techniques and hands on experience
Advantest digital automatic test equipment (ATE) hands on experience
Hands on Scan/ATPG debug
Sound theoretical knowledge of Digital/Analog CMOS circuits
Experience with CAD layout tools
2+ years hands on experience in semiconductor IC Failure Analysis. Experience in:
Beam tools (FIB/PFIB/SEM) experience with TEM Lamella Sample preparation
TEM Analysis
Structural debug (ATPG) for yield
Fault isolation techniques: Emission Microscopy, LASER based stimulation techniques; LIVA/TIVA/CTM, Thermal emission, Curve tracer, X-ray imaging etc.,
Tools/techniques that use Solid Immersion Lens (SIL)
Hands on experience with laser Voltage Probe (LVP), e-Beam system is a definite plus
Education Requirements:
Required: Bachelor's, Electrical Engineering or Electronics and Communications
Preferred: Master's, Electrical Engineering
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range:
$104,000.00 - $156,000.00
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