Nvidia Senior 3D IC Flows Methodology Development Engineer 

United States, California 

717816805

What you'll be doing:

• Innovate on 3D-IC Heterogenous integration as a comprehensive co-optimization from System to Silicon in partnership with domain experts.

• Establish 3D-IC prototypes across market segments. Collaboration with Product teams to identify critical product characteristics and target setting requirements.

• Engage with EDA providers on 3D-IC EDA feature requirements and 3D-IC design methodology.

• Design optimization of 3D advanced silicon/package technology features to enable strong product differentiation.

• Design analysis and optimization for 3D-IC Advanced Silicon and Packaging technology definition and certification.

• 3D-IC Test Chips validation of 3D-IC technology platforms and design methodology.

What we need to see:

• MS or PhD degree in Electrical or Computer Engineering (or equivalent experience)

• Minimum of 5+ years' experience in 3DIC, interposer and package design.

• Deep understanding and experience driving digital design flows and EDA vendor engagement.

• Experience with Testchip designs and/or Product designs.

• Multiple clock domain and Low Power Design.

• Expertise with Python, TCL

• Enjoy working with multiple levels and teams across organizations.

• Effective verbal/written communication, and technical presentation skills

• Self-starter with passion for growth, real enthusiasm for continuous learning and sharing findings across the team.

Ways to stand out from the crowd:

• Familiarity with Machine Learning/Deep Learning

• Experience in other Physical Design methodologies such as P&R, DFT, STA etc.