Amazon Interconnect Productization Lead Annapurna 

United States, California, Cupertino 

714410813

As an Interconnect Productization Lead, you will be responsible for ensuring the correct operation and scalability of PCIe and other Interconnects used in our custom machine learning chips. You will work with architecture, IP owners, DV, software and signal integrity teams to productize the latest interconnect technology in both pre-silicon and post-silicon.Key job responsibilities
* Gain a deep understanding of SoC architecture and interconnects.
* Work with architecture, design, DV, SIPI and SW teams to verify and integrate interconnect functionality and performance.
* Build verification environments for both pre-silicon and post-silicon.
* Drive robust and stable high speed interface configurations in the data center.Work/Life Balance
Mentorship and Career Growth
We’re continuously raising our performance bar as we strive to become Earth’s Best Employer. That’s why you’ll find endless knowledge-sharing, mentorship and other career-advancing resources here to help you develop into a better-rounded professional.Diverse Experiences
Amazon values diverse experiences. Even if you do not meet all of the preferred qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn’t followed a traditional path, or includes alternative experiences, don’t let it stop you from applying.

- Proficiency in PCIe, Memory(HBM, DDR), and other Interconnects.
- 5+ YoE in developing silicon, SW/HW co-design and pre-silicon environments.
- Experience in post-silicon debugging/bring-up of high speed interfaces.

- Proficiency in SoC architecture.
- Proficiency in programming low-level programming and scripting.