Intel FEOL Front-End-Of-Line Customer Integration Engineer 

United States, Arizona, Phoenix 

70482141

Job Description

FEOL (Front-End-Of-Line) Customer Integration engineers' responsibilities include (but not limited to):

• Be the DRI (Directly Responsible Individual) to support customer improvement projects and respond to process issues on behalf of the customer.
• Will be responsible for regular communication with the customer and from the customer to the factory.
• Be the single point of contact for FEOL process integration issues for customer.
• Own inline CpK for critical customer parameters.
• Collaborate with FEOL Technology Development team to import new technology to Customer Products.
• Work with FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.
• Own engineering projects to improve product yield, quality, performance and to reduce wafer cost.

Candidate should possess the following behavioral skills:

• Problem-solving technique with strong self-initiative and self-learning capabilities.
• Comfortable working with a high degree of autonomy
• Ability to work with multi-functional, multi-cultural teams.
• Must demonstrate excellent communications skills and the ability to distil complex information in to easily understandable messages.
• Must possess a high degree of ownership for problems with a high tolerance for ambiguity.

Minimum Qualifications:

• Bachelor's degree in science and engineering major.
• 10+ years' experience in advanced node semiconductor industry in FEOL Process Integration. Level of experience will be considered in determining applicants job grade.
• 10+ years' experience in advanced node semiconductor development or high-volume manufacturing.

Preferred Qualifications:

• Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science major is preferred. Other related science and engineering degrees can be considered based on industry experience.
• Experience in project/program management and advanced problem solving.
• Demonstrated interpersonal skills including influencing, engaging, and motivating.
• Experience in new semiconductor technology development.
• Solid understanding and collaboration experience with module processes including lithography, dry etch, wet etch, CMP, thin films and metrology.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits Annual Salary Range for jobs which could be performed in the US $136,990.00-$193,390.00*Salary range dependent on a number of factors including location and experienceThis role will require an on-site presence.