Microsoft Sr Signal Power Integrity Engineer 

United States, North Carolina, Raleigh 

688507182

Required/Minimum Qualifications

• 7+ years of related technical engineering experience
  • OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experience
  • OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience or internship experience
  • OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field.
• 5+ years of experience in silicon/package/system signal integrity and power delivery
• Working knowledge in the field of end to end system SIPI Design and Architecture
• Industry knowledge, trends and landscape of technologies to drive development across Silicon-IP, Advanced packaging, Substrate technology, Board technology and Platform design

Additional or Preferred Qualifications

• 11+ years technical engineering experience
  • OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience
  • OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience
  • OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience.
• 10+ years’ experience in silicon packaging products development
• Experience with high-speed signal design and/or power integrity modelling for HPC products
• Strong foundation in advanced packaging technologies as it relates to Signal and Power integrity
• Experience with Foundry Silicon technologies, OSAT technologies and Substrate technologies
• Expertise in the field of Signal and Power Integrity and delivery, System design, IP design with knowledge on product development with minimum 5 years’ experience in design and electrical modelling
• Interpersonal skills including written and verbal communication, teamwork, negotiation, and presentation

Microsoft will accept applications for the role until December 20, 2024.

Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

The SMPE silicon team is seeking a passionate, driven, and intellectually curious computer/electrical engineer to deliver premium-quality designs once considered impossible. We are responsible for delivering cutting-edge, custom IP and SoC designs that can perform complex and high-performance functions in an extremely efficient manner.

• SIPI engineer for compute and AI SoCs and platforms – Implement strategies for end-to-end power delivery design and signal integrity design from Silicon to Package, and linking to Platform to System and Cloud
• Deliver SIPI solutions that meet the HPC demands across the entire system.
• Drive future power and signal integrity solutions for chiplet architecture with advanced packaging and advanced silicon nodes
• Design, model, and simulate SI and PI (i.e., incl. IP design, voltage regulator, motherboard, CPU package, silicon, and decoupling capacitor solution) for data center processors and corresponding platforms to ensure optimized performance. Performs DC, AC and transient simulation to provide noise, impedance profile of the whole power delivery path and link/electrical simulations to validate I/O performance from platform to silicon.
• Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
• Drives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines
• Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.