Cisco Principal Hardware Engineer 

United States, California, San Jose 

681614473

In this role, you will:

• Develop and lead the system thermal technology roadmap in partnership with microelectronics packaging suppliers, thermal interface material suppliers, cooling solution providers, and internal partners to meet Cisco products’ needs.
• Investigate innovative thermal cooling solutions for hardware systems on a large scale.
• Derive trade-offs in thermal performance of different package design elements and chip thermal gradients from experimental test data.
• Develop test plans and qualification requirements to ensure mechanical and manufacturing adaptability of thermal cooling solutions.
• Engage with external vendors, including ODM and component vendors, on design, test, and production.
• Develop and publish case studies/technical papers describing thermal analysis of cooling systems.
• Establish parameters for thermal design/testing and correlate design/test results to model predictions.
• Contribute to analytical and numerical models using Computational Fluid Dynamics tools to simulate and analyze different device-level cooling schemes.
• Drive supplier ecosystem development and participate in industry consortia, conferences, and collaborate with academia and other strategic partners to influence Cisco’s industry position.
• Integrate Circuit Thermal simulation and testing with system-level cooling technologies.
• Conduct mechanical design validation and testing for electronic assemblies.
• Coordinate Circuit Packaging technologies.
• Perform component and system reliability analysis.

• BS in Mechanical/Thermal or Chemical Engineering.
• 15+ years of experience in the design, simulation, and testing of thermal solutions for electronic devices and systems.
• Extensive experience with advanced air-cooling technologies.
• Experience with liquid cooling and/or immersion cooling.
• Experience with troubleshooting and thermal validation with data acquisition systems.

• MS or PhD in Mechanical or Chemical Engineering or related field.
• 20+ years of relevant proven experience in microelectronics thermal cooling.
• Experience with JEDEC JESD 51 thermal testing standards.
• Experience with Thermal Interface Material Thermal Conductivity Testing procedures.