Intel NAND Collateral DTCO Engineer 

China, Liaoning, Dalian 

680150836

Technical Qualifications -- MS, or PhD in a science or engineering field and minimum 3 years of experience in semiconductor research, development or manufacturing environment are required.--Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking;--Direct experiences in technology development, transfer or startup are required, a leader role experience is preferred;--Strong expertise of semiconductor device and fab process flow, process/design qualification and troubleshooting is required;--Direct hands-on experience on one or multiple of relevant areas is highly desired such as Process integration/Device, PDK, DTCO/PPA, Litho process, OPC/Mask/Tapeout, TCAD, Metrology, Fab process(Etch, Thinfilm, Implant and CMP etc.).--Familiar with standard EDA tools(Cadence Virtuoso, Mentor Calibre, Synopsys S-Litho, etc), scripting capability is a plus.Other Qualifications--Motivated self-starter, with strong ability to work independently as well as in a team environment;--Strong verbal and written communication skills in English;--Think and operate independently, while simultaneously focusing on many diverse priorities;--Flexibility and maturity in facing uncertainties and changing priorities/responsibilities;--Commit to aggressive goals and win with a can-do attitude;--Act with velocity and a strong sense of urgency;--Respect cultural diversity and sensitivity;--Agility in learning, improving, and innovating.We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing BenefitsThis role will require an on-site presence.