Intel Group Leader Failure Analysis Fault Isolation FA/FI Manager 

Ireland 

673624707

This job requisition is seeking a Failure Analysis & Fault Isolation (FA/FI) Group Leader working inour FSM Ireland Analytical Laboratories

FI/FA Group Leader’sresponsibilitiesinclude (but are not limited to):

• Nurture, grow & lead newly formed team, responsible for team health and people management, including hiring, technical coaching, skill development, training, and performance management.

• Review team’s work and ensure technical accuracy, provide guidance and recommendations on approaches to characterize complex analyses.

• Deliver world class operational performance in safety, quality, and lab throughput along with tactical management of area.

• Understand area workflows and equipment, help manage tool fleet including optimizing area to increase output & reduce tool down time.

• Present results of key analyses to internal and external customers.

Candidate should have the following
behavioral skills:

• Demonstrated strength in leadership, teamwork, problem solving, and effective oral and written communication skills.

• Desire to learn and expand knowledge in field.

• Ability to work with multi-functional, multi-cultural teams.

• Strong in decision making and problem solving.

• A good motivator, with ability to listen.

• Bachelor's degree in science and engineering major.

• Ireland candidates minimum Level 8 Bachelors' degree.

• 4+ years' experience in a semiconductor failure analysis laboratory.

Qualifications:

• Advanced degree (Master's or Ph.D.) in science and engineering major.

• 10+ years’ experience in a semiconductor failure analysis laboratory supporting advanced technology node technology development.

• Strong understanding of TEM sample preparation and imaging.

• 4+ years’ experience with 6T SRAM & logic failure analysis.

• Strong technical understanding of modern fault isolation & failure analysis techniques, from fault isolation, nanoprobing through physical analysis.

• Understanding of FinFET technology architecture, including Cu metallization.

• Basic understanding on fabrication processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.