Texas Instruments Digital IC Design Engineering Intern 

China, Shanghai 

671433212

As a Digital IC Design Engineering intern, you'll architect new TI products and make our customers' visions a reality. You'll define, design, model, implement and document analog, digital, and RF integrated circuits (ICs). And, you'll have the opportunity to work in exciting areas like audio, imaging, high-speed, interface, clocking, medical, high volume linear, automotive, storage, power supply, battery management, linear power and many more.Some of your responsibilities will include, but will not be limited to:

• Partnering with business teams and system engineering to develop mutually agreeable design specifications
• Providing high-level analysis on chip architecture trade-offs to ensure spec compliance and superior performance at a competitive cost
• Participating in design reviews and creating the necessary design and product documentation
• Partnering on IC layouts to ensure a high-performance standard
• Characterizing prototypes, developing test specifications and coordinating with test/product engineering to drive product releases
• Driving behavioral models

Minimum Requirements:

• Currently pursuing a Bachelors degree in Electrical Engineering, Electronics Technology, Computer Engineering, Electrical Engineering Technology, Electrical and Computer Engineering or related field
• Cumulative 3.0/4.0 GPA or higher

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery