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Johnson Electric 封装研发经理 China, Guangdong Province, Shenzhen 641173623
08.04.2025
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Key Responsibilities:
- Lead and manage IC packaging projects, focusing on automotive MOSFET/MCU packaging (e.g., DFN5*6, QFN).
- Deeply understand and optimize the physical characteristics of each packaging process.
- Innovate packaging solutions to reduce costs while maintaining high standards of reliability and quality.
- Collaborate with cross-functional teams to implement process improvements and cost-saving initiatives.
- Stay updated with industry trends and advancements in IC packaging technologies.
- Hands-on experience in automotive MOSFET/MCU packaging, specifically DFN5*6 and QFN.
- In-depth knowledge of the physical characteristics of each packaging process.
- Experience working in top packaging companies or packaging departments within leading IC companies.
- Proven ability to innovate packaging solutions for cost reduction.
- Expertise in process optimization to achieve cost savings without sacrificing reliability or quality.
- Master’s degree or above from a top university is preferred.
- Strong problem-solving skills and attention to detail.
- Excellent communication and leadership abilities.
- Ability to work effectively in a fast-paced, collaborative environment.
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