Bachelor's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience.
8 years of experience in electronics packaging/server systems/data center or related industry.
Experience working with cooling strategies used for packages, boards, systems and data centers.
Experience with developing and executing thermals technology innovation.
Experience in one or more advanced cooling techniques such as liquid cooling, thermal interface materials, thermo-electric devices, two-phase heat transfer or heat exchangers.
Experience working with OEM, ODM, and cooling system and component suppliers.
Preferred qualifications:
Master's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience.
12 years of experience in in electronics packaging/server systems/data center.
5 years of experience with Computational Fluid Dynamics (CFD), thermal analysis modeling and characterization (e.g., FloTHERM, IcePak, and Computer Aided Design (CAD)).
Experience in establishing project goals, coordinating resources, and providing technical leadership.