Amazon Quantum Hardware Engineer AWS CQC 

United States, California, Pasadena 

63410492

Key job responsibilities
Responsibilities include developing, improving and sustaining fabrication and packaging processes; analyzing inline metrology and electrical test data; interacting with project leads to provide feedback that continuously improves the process. Candidates must have a demonstrated background in sound engineering principles, and must have superlative data analysis, problem solving, and communication skills. Successful candidates will have experience in wire-bonding, flip chip bonding, SoC and SiP techniques and tools. Working effectively within a team environment is critical.A day in the life

- BS in physics, applied physics, material science, electrical engineering or related field
- 2+ years of relevant industry experience (or equivalent lab experience in an MS or PhD program)
- Expertise in one or more of the following lithography processes and tools: Flip chip bonding tools, wafer bonding tools, SoC and SiP techniques.

- MS or higher in physics, applied physics, materials science, electrical engineering or related field
- Good working knowledge in two or more of the following device fabrication areas: MEMS, photo lithography, metal/dielectric/silicon etching, metal/dielectric thin film deposition, epitaxy, CMP, plating processes, process integration, and electron/ion/x-ray/scanning probe characterization tools
- Great problem solving and analytical skills
- Communication and data presentation skills
- Basic programming skills (e.g. Python, Julia, MATLAB)
- Experience or knowledge in superconducting microwave devices or superconducting qubits is a plus