Qualcomm FY24 Summer Intern-Coreplatfrom SW Engineer 

China, Sichuan, Chengdu City 

629961339

Job Area:

Interns Group, Interns Group > Interim Engineering Intern - SW

SW development on Qualcomm Chips. new feature design, technology investigation, system optimization, code developing and cross team co-work. There are some main areas

1. SW development on Mobile chips. For stability,kernel,BSP,Power,Securtiy and so on.

2. SW development on Wifi/Bluetooth chips,For drivers, stack and networking applications

3.SW development on Auto chips.

4.SW development on GPS.

5.SW development on ethernet switch chip

1. Solid C/C++ , Linux shell programming skills, experience in Python/Perl/Java/Makefile/Andriod is preferable

2.Familiar with Linux OS, driver and kernel development, one or more of following: u-boot, PCIe/PCI, Ethernet, DDR, LCD,Camera, USB, and Power Management.

3.Familiar with CPU architecture such as ARM and MIPS is a plus

4.Familiar with machine learning will be a plus

1. Experience in Linux/OpenWrt/Android WIFI driver development is preferred

6.Familiar with ARM Trustzone and virtualization or security and cryptography will be a plus

7.Basic Hardware knowledge

8.Excellent interpersonal and communication skills in both English and Mandarin

9.Faster learner; able to grasp concepts with only basic training and the initiative to ask questions.

10.Basic debugging and problem solving skills.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.