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Apple Technical Program Manager TPM SiP - Korea United States, Washington, Seattle 624205249
18.07.2024
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Description
On site – Technical Operations owner for MP readiness of NPI, Ramp, and Sustaining areas of System in Package productsApprove vendor process flow, process quality control plan (tests, methods, sample sizes, pass /fail criteria), equipment list, and Cosmetic specs (Ensure cosmetic standards are aligned with Module integrators) for MP readinessConduct site quality and process audits for Mass production readinessContribute to mass production release reviews and verify that all we are ready to rampIn mass production, lead resolution of device related quality issues in assembly processing, transit, and module integratorSet a vision for constant product quality and operational improvement year over year. Set aggressive targets and drive plans to achieveBe involved at product concept to ensure products are designed for manufacturing (DFM). Build in constant design improvement for product quality, factory efficiency and product costManage new process introduction and special projects, such as new machinesEnsure device vendors are conforming to Apple specs and requirementsEnsure timely test correlation activities and close test gaps between device, module, and systemMonitor and report yield, manufacturing metrics (CpK, FMEA etc.). Drive improvement programs as appropriateDrive FACA for sensor related returns from integrators, field returns, and EFFA issues. Track, report and close out issues in a timely mannerEnsure 8D reports and PCNs are maintained accuratelyRaise and balance formal company-wide Quality AlertsOrganize three-way meetings with device vendors and OSAT vendors to get feedback on downstream issues and to ensure smooth co-working. Assist and arbitrate as neededManage the quality relationship with Korea OSAT vendors. This involves regular face to face reviews, efficient vendor reporting systems and auditsEnsure qualification and reliability activities at vendors are in line with requirementsRegularly provide status reporting updates to executives and escalation when neededConstant interfacing and collaboration with multiple functional teams across Apple and external suppliers including teams in Supplier Quality, System Quality, Reliability, Device Design, Module Design and NPI project management
Minimum Qualifications
- BS/MS in Engineering or related technical subject area
- Minimum of 5 years experience in Package engineering fields (Process Eng, Process integration engineering, or Product engineering). 10+ years of experience is preferred
- Solid experience and background in module component processes
- Working proficiency of the English language
Preferred Qualifications
- Familiarity with Packaging quality systems and in line process quality control. Ability to audit and approve vendor process, process flow and equipment for new devices
- Experience with external vendor, supplier, or foundry management
- Strong technical skills, involving problem solving and issue root causing in a pressured environment
- In-depth understanding of module test, yield, assembly process integration, module packaging issues
- Flexibility: Evening and weekends work will be required
- Solid understanding of semiconductor devices and associated module components
- Interpersonal skills of leadership, project management, communication, teamwork, influencing and negotiation
- Flexibility for within Korea travel (30%) + International Travel (< 5%)
- Strong ability for teamwork and collaboration
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