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What you’ll be doing:
Own module New Product Introduction for Datacenter and HPC products.
Interface with Engineering, Mechanical, Thermal, Program Management, and Operations to ensure modules are released on time, with high quality, and high yield.
Partner with test engineering to enable manufacturable test solutions
Coordinate with chip and system teams to achieve high test coverage
Plan and review characterization reports to demonstrate highly manufacturable board solutions
Drive continuous yield improvement and manufacturing optimizations
Assist reliability teams with board qualification
Review supplier performance and assess capability to achieve product requirements
Identify opportunities and methods to optimize module NPI processes
What we need to see:
BSEE or equivalent experience
8+years in product/product development engineering or equivalent role
Proven record of leading release of complex GPU or board projects on time, with high quality
Successful collaboration with worldwide teams to achieve program goals
Understanding of data center products, requirements, and tradeoffs
Driving suppliers to deliver on engineering and operations requirements
Knowledge of mechanical, thermal, and automation solutions
Excellent thought process for identifying risks and developing robust mitigations
Analyze and summarize relevant data to make sound decisions
Ways to stand out from the crowd:
Experience with system test development
Familiar with HPC and datacenter requirements
Incorporate advanced memory solutions
Utilize high speed testing concepts
Python and scripting knowledge
You will also be eligible for equity and .
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