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As a member of the Mixed Signal Design team, you will be a key member of a small, dynamic IC Design group that develops high speed (>25Gb/s), and high accuracy, analog designs for optical communications products. You will architect, design, layout, measure and productize ultra-deep sub-micron-based CMOS products.
You will lead efforts for a large block on a complex chip, mentor team members and track deliverables, participate in peer review of complex IC designs and provide solid design methodology from conception to production.
You will also collaborate with packaging and hardware design team to ensure signal and power integrity specifications are met.
You will work with other Acacia mixed-signal engineers to collaborate in order to provide an optimized design that will integrate into the ASIC. In addition, you will have the opportunity to interact with other Acacia groups including digital/DSP design, system design, package design, and module design.
You are enthusiastic about developing high speed AMS circuits and best-in-class products that push the boundaries of what is possible. You are detail oriented, high energy and the drive to get things done and solve difficult problems.
Minimum qualifications:Possess a track record of innovation. Publications are a plus.
We tackle whatever challenges come our way. We have each other’s backs, we recognize our accomplishments, and we grow together. We celebrate and support one another – from big and small things in life to big career moments. And giving back is in our DNA (we get 10 days off each year to do just that).
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